According to news on March 21, due to the increasing investment costs of 3nm and more advanced processes, in order to continue to promote the overall performance and cost of chips and reduce costs, 2.5D/3D advanced packaging technology is increasingly favored by the industry and

html News on March 21, due to the increasing investment costs of 3nm and more advanced processes, in order to continue to promote the overall performance and cost of chips and reduce costs, 2.5D/3D advanced packaging technology is increasingly favored by the industry and has entered the period of rapid growth.

According to statistics from market research firm Yole Developpement, Intel and TSMC were in the leading position in capital expenditures in the advanced packaging field last year, and at the same time had a say in technology formulation. ASE Investment Holdings and Samsung were following closely behind. The top four manufacturers The total proportion of capital expenditure is as high as 85%.

According to data from Yole Developpement, the total capital expenditure of the world's top seven 2.5D/3D packaging semiconductor factories last year reached US$11.909 billion. Among them, Intel, TSMC, and ASE Investment Holdings ranked the top three, followed closely by Samsung and Amkor. Later, mainland packaging and testing manufacturers Changdian Technology and Tongfu Microelectronics also ranked sixth and seventh.

As chiplet design has become the development trend of high-performance chips in the future, 2.5D/3D packaging capital expenditure will increase significantly in the next three years.

Yole Developpement data shows that the global advanced packaging market reached US$2.74 billion last year, and the compound annual growth rate (CAGR) from 2021 to 2027 will reach 19%. The market size will grow to US$7.87 billion in 2027.

Intel’s capital expenditure in the 2.5D/3D packaging field last year reached US$3.5 billion, mainly investing in the research and development and production capacity expansion of advanced packaging technologies such as Foveros and EMIB. Intel believes that 3D packaging can continue Moore's Law and give designers options across heat dissipation, power consumption, high-speed signal transmission and interconnect density to maximize and optimize product performance. Among them, the Sapphire Rapids server processors and Ponte Vecchio data center GPU chips to be launched this year, as well as the Meteor Lake processors that have begun trial production, will all use Foveros technology.

TSMC has launched technologies such as CoWoS and InFO in 2.5D packaging and entered mass production. Last year, 2.5D/3D packaging capital expenditure reached US$3.049 billion, ranking second in the world. It will expand the number of system integrated chips (TSMC-SoIC). Advanced packaging technology promotion and production capacity construction of WoW (wafer on wafer) and CoW (chip on wafer) of 3D Fabric platform.

It is understood that major customers including Apple, MediaTek, AMD, Xilinx, Broadcom, NVIDIA and other major customers have adopted TSMC's advanced packaging technology.

Sun Moonlight Investment Holdings' capital expenditure in the 2.5D/3D packaging field last year reached US$2 billion, ranking third. With the deployment of advanced FoCoS packaging technology, it is currently the only company in the packaging and testing foundry (OSAT) industry with ultra-high The industry leader in density fan-out solutions.

Samsung invested US$2 billion in the 2.5D/3D packaging field last year. It has recently planned to integrate its packaging and testing related resources to accelerate the layout of advanced packaging to cope with the rapid development of HPC applications in heterogeneous chip integration. Amkor invested approximately US$780 million in the 2.5D/3D packaging field last year, and its layout remains steady.

The top five manufacturers’ cumulative capital expenditures on advanced packaging accounted for 91% of the world’s total investment, indicating that the market is still dominated by first-tier manufacturers.

Editor: Xinzhixun-Lin Zi Source: Business Times