core technology news , what role will TSMC Miaoli Zhunan Advanced Packaging and Testing Factory, which has launched environmental impact assessment, play in the future? The latest news will lock in the next generation of advanced packaging technologies including SoICs, WoW, and CoW. The supply chain has also been reported that HiSilicon, a subsidiary of Huawei in Mainland China, will be included in the first batch of cooperation targets, and Zhunan Advanced Packaging Factory is expected to provide capacity support. However, TSMC did not make any official comments on the news.
TSMC system integrated chip technology (System-On-Integrated Chip) combined with WoW (Wafer-on-Wafer) and CoW (Chip-on-wafer) processes can provide manufacturers with services that allow various design combinations. TSMC's SoICs concept mainly continues with the previously developed 2.5D/3D IC packaging process CoWoS (Chip-on-Wafer-on-Substrate) and the later WoW packaging. TSMC intends to expand its advanced packaging capabilities, and Zhunan will have the opportunity to become one of the bases for advanced packaging and testing. Currently, TSMC's advanced packaging and testing plants are distributed in Bamboo Science, Zhongke Science, Nanke Science and Longtan.
The supply chain has also been reported that Huawei's IC designer HiSilicon will be the first to import WoW packaging and combine it with HBM's high-end chips. Since Huawei brings vast overseas production capacity, and the development of integrated chips combining efficient computing and artificial intelligence is also a global trend, the establishment of TSMC's Zhunan factory may bring greater capacity support. However, TSMC has not commented on market rumors, progress and specific products.
Semiconductor-related manufacturers pointed out that TSMC is taking quite fast and forward-looking in the field of advanced packaging; although CoWoS locks in high-end chips with low quantity and precision, InFO (integrated wafer-level fan-out package) extended by 2.5D technology is well-known for helping TSMC stabilize Apple AP orders. It is estimated that TSMC's monthly production capacity has expanded from the previous 70K to 200K, which is higher than the total of other outsourced packaging and testing foundry manufacturers. (Proofreading/Fan Rong)
