Recently, TSMC (TSMC) announced at the OIP forum that it will launch the 3DFabric alliance, which will be the first innovative alliance in the semiconductor industry to accelerate the 3D IC ecosystem with partners, providing a comprehensive range of first-class solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing and packaging. Currently, 19 partners have joined, including Meiguang, SK Hynix , Arm, Siemens , Sun and Moonlight, Synopsy , etc.
Currently, TSMC OIP consists of six alliances, namely the EDA Alliance, IP Alliance, Design Center Alliance (DCA), Value Chain Alliance (VCA), Cloud Alliance , and the latest 3DFabric Alliance. The new alliance will help customers quickly implement chip and system-level innovation, using TSMC's 3DFabric technology, comprehensive 3D stacking and advanced packaging technologies to promote the development of next-generation HPC and mobile applications.
TSMC hopes to help customers overcome the complexity of semiconductor design by creating new collaboration models, organizing the development and optimization of cross-TSMC technology, electronic design automation (EDA), and IP and design methods. Members of the 3DFabric Alliance can obtain TSMC's 3DFabric technology as soon as possible, and simultaneously develop and optimize solutions with TSMC, covering solutions and services for EDA, IP, DCA/VCA, storage, packaging testing (OSAT), substrate and testing.
TSMC's 3DFabric technology is an advanced packaging technology, including front-end 3D chip stacking or TSMC-SoIC (system integration chip), back-end CoWoS and InFO series packaging technologies, to achieve better performance, power consumption, size, appearance and functions, and achieve system-level integration.
