1, the "Intel Processor" brand was released to further clarify the value positioning of flagship products
Recently, Intel launched a brand new processor for its main product series: "Intel® Processor". The new product will replace the Intel Pentium® and Intel Celeron® brands in the laptop released in 2023. Josh Newman, vice president and acting general manager of the mobile client platform business unit of Intel Corporation, said: "Whether in work or entertainment scenarios, the rapid development of technology continues to change the world, and the importance of PC has become more obvious. Intel is committed to promoting innovation to benefit users. At the same time, our entry-level processor product family is crucial to enriching the PC price segment. The new "Intel Processor" brand will provide streamlined product choices, allowing users to choose processors that meet their needs more targetedly."
2. Industry insiders: IC design manufacturers are scrambling to enter the HPC field
Research and Research Agency IC Insights data shows that the current IC market is weak, mainly due to inflation, unsmooth supply chain and OEM manufacturers' commitment to reducing IC inventory. Industry insiders revealed that in the face of high inventory pressure, various manufacturers already have solutions. Recently, the design of non-consumer products has scrambled to turn to the field of high-speed computing (HPC), and it is expected that the inventory of IC design will improve significantly by the second half of this year.
3. TSMC: The plan to set up a factory in Kaohsiung remains unchanged, and it is preparing to prepare land for land preparation this year
Taiwan Economic Daily reported on September 19 that TSMC announced in November last year that it would set up a factory in Kaohsiung, but construction has not started yet, which has attracted attention from the outside world. TSMC stated today that the Kaohsiung factory plan remains unchanged and is expected to be groundbreaking this year. It is currently preparing for land preparation. Thanks to relevant government units for their assistance. TSMC Kaohsiung Factory is expected to start mass production in 2024, focusing on 7-nanometer and 28-nanometer processes.
4 and LG are expected to mass-produce the Apple iPhone 14 LTPO OLED panel in mid-October
LG Display is expected to mass-produce the Apple iPhone 14 Pro Max Organic Light Emitting Diode (OLED) panel in October. The iPhone 14 Pro Max OLED uses low-temperature polycrystalline oxide (LTPO) thin film transistor (TFT), which is an advanced technology. It is understood that LG Display has been hindered from mass production of LTPO-type iPhone OLED panels, mainly due to mask and process problems, so the mass production time is expected to be postponed to mid-October.
5, iPhone 14 is equipped with Qualcomm satellite modem and Apple's new RF chip
September 18, according to foreign media reports, according to iFixit analysis and an Apple's statement, the iPhone 14 model contains a Qualcomm chip that can talk to satellites, as well as an additional customized RF chip and related software that Apple has designed. According to reports, a major new feature of Apple's iPhone 14 series is the ability to connect to satellites to send emergency messages without WiFi or mobile phone data connection.
6, Lekko Defense : The company cooperates with Huawei in the field of 5G millimeter wave antennas
Lekko Defense In terms of business, the company cooperates with Huawei in the field of 5G millimeter wave antennas. The company cooperates with many domestic companies in the field of intelligent driving and smart transportation, including Huawei.
7, Hon Hai : Silicon carbide components produced by its Zhuke 6-inch factory are undergoing automotive specification certification, and it is expected to mass produce
next year. According to reports, Hon Hai Group's semiconductor layout has taken another big step. Its Zhuke 6-inch factory has produced the first silicon carbide (SiC) component. In the initial application, industrial products are mainly used. It is currently undergoing automotive specification certification and is expected to mass produce next year. Hon Hai predicts that major breakthroughs in related semiconductor layout will be displayed on "Hong Hai Technology Day" on October 18.
8. Hangjin Technology: The company has the R&D and design capabilities of IC products
Hangjin Technology currently focuses on special chip business, has the R&D and design capabilities of IC products, and also has the complete back-end packaging and testing production capacity. It realizes spectral layout in analog categories such as op amp +AD, interface, PMIC, clock, etc., and continues to invest in image processing and storage.In addition, the company actively deploys Beidou high-precision positioning chips and RF front-end chip products based on IPD technology in the civil field.
9, Tesla's Texas factory has a cumulative output of Model Y, which has reached 10,000
, Tesla announced that its super factory in Texas, USA has produced a cumulative output of 10,000 Model Y electric SUVs, and the company is currently continuing to work hard to increase production. In addition to the Texas factory in the United States, Tesla is currently trying to increase production in its super factory in Berlin, Germany. The company expects the two plants to double capacity by the end of next year.
10, Lihewei : The new generation of HPLC dual-mode chip has completed chip production and verification
At present, State Grid Corporation is actively formulating high-speed dual-mode communication technical specifications, and at the same time actively planning "HPLC+high-speed wireless" dual-mode technology and chip application. The company is one of the companies participating in the formulation of standards. The company has deployed power line carrier dual-mode technology earlier, and the new generation of HPLC dual-mode chips have completed chip production and verification. The company's high-speed dual-mode related products have been developed and mature.
