#Samsungchallenge3nmchip# In recent years, self-developed chips have become the goal of many mobile phone manufacturers. OPPO, Xiaomi, Huawei, etc. have all released their own self-developed chips. However, the road to developing chips is not as simple as everyone imagines. The i

In addition, there is also new news about Qualcomm’s flagship chip. Not long ago, Qualcomm announced that it will hold the Snapdragon Technology Summit from November 14th to November 17th, when Snapdragon 8 Gen 2 is expected to meet with everyone. It is reported that Qualcomm's second-generation Snapdragon 8 is based on TSMC's process and adopts a new "1+2+2+3" eight-core architecture design, consisting of Cortex-X3 ultra-large core, 2 Cortex-A720 large cores, 2 Cortex - It is composed of A710 large core and three A510 energy-efficiency cores. The GPU is Adreno 740. While the performance is greatly improved, the power consumption will be lower. The baseband will be Snapdragon X70, which supports 10Gbps 5G peak download speed. Snapdragon 8 Gen2 may Become the key to Qualcomm's reversal of the situation.

It seems that starting from December this year, many mobile phones equipped with Snapdragon 8 Gen2 processor will be released, and the reason why Qualcomm seems to be in a hurry is that MediaTek has such a strong impact this year. I am afraid that if I try hard, I will give up the "cake" that was finally formed. In fact, there is no shortage of innovation in the chip market. The process, form, performance, etc. are all bringing surprises to people. Manufacturers such as OPPO, Xiaomi, Huawei, and Samsung are all working hard. Recently, there have been a lot of explosive news in the chip market. A chip revolution may be about to begin.

As we all know, Samsung’s 3nm process does not have a very good reputation in the market. In addition, the share gap with TSMC is gradually widening, which has also allowed Samsung to speed up the progress of the 3nm process. Many media have recently reported that Samsung will mass-produce 3-nanometer semiconductors based on GAA on June 30. Compared with the 7nm process, the logic area efficiency of this type of semiconductor has increased by more than 45% and the power consumption has been reduced by 50%. %, the performance is improved by about 35%. The overall structure is better than the current mainstream FinFET structure, and it is the most advanced process technology on the market. Now that Samsung has begun mass production of 3nm, TSMC is expected to move quickly. The initial production capacity may be very low, but we may still use the mobile phone chip of the 3nm process in 2023.

In addition to the progress in process technology, the form of the chip also seems to have surprises. We have all heard of modular mobile phones , but the chip seems to be modular. Recently, engineers from MIT designed a stackable and reconfigurable artificial intelligence chip that uses light to transmit information. , the relevant results have been published in the journal. Nowadays, mobile phones are being updated very quickly, and many people are changing their phones for the latest chips. If modular chips can really be put into mass production, then changing mobile phone chips in the future will be as easy as changing phone cards, and there is no need to spend money on them. High-performance chips can be used in mobile phones, which is undoubtedly a revolutionary subversion for the mobile phone market.

In addition to the above exposed information, it is rumored that the chip design company Arm has also launched a new chip technology that can improve mobile phone video, game quality and battery life; Xiaomi will also launch a new battery chip that can reduce the cost of mobile phones. Power consumption; OPPO’s second-generation Mariana Intensified, innovation is also intensifying. The road to self-research is "very fragrant", but the road will be long and the risks will be great. It depends on whether the manufacturers can continue to persist.