Wingtech’s "12-inch automotive-grade power semiconductor wafer manufacturing project" started on the 4th in the Lingang New Area of China (Shanghai) Pilot Free Trade Zone (hereinafter referred to as the Lingang New Area).
According to Wingtech, the total investment of the project is 12 billion yuan (RMB, the same below), with an estimated annual output of 400,000 wafers. The packaged and tested power device products can be widely used in automotive electronics, computing and Communication equipment and other fields. On August 19, 2020, the project, as China's first 12-inch automotive-grade power semiconductor automated wafer manufacturing center project, was signed and settled in the Lingang New Area.
Wentian, Wingtech, and Dingtai Craftsman Chairman Zhang Xuezheng said that Lingang New Area is already an important electric vehicle industry base in China. Wingtech’s 12-inch automotive-grade power semiconductor wafer manufacturing center project is important The construction of a world-class electric vehicle industry chain in the new area is of great significance.
Lingang New Area is the "important town" of Shanghai integrated circuit development. Shanghai officials are speeding up the construction of the "Oriental Chip Port" integrated circuit industrial base in the Lingang New Area.
Lingang New Area Management Committee full-time deputy director Wu Xiaohua said that Lingang New Area has signed 42 key industrial projects involving integrated circuit industry projects, with a total investment of 112.8 billion yuan.
Manuscript source: China News Network
Image source: Paixin.com
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