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US media said that China has established a new National Semiconductor Fund worth 204.15 billion yuan (approximately 28.9 billion US dollars). China is seeking to cultivate a local chip industry and narrow the technology gap with the United States. According to a report on the US "Wall Street Journal" website on October 25, according to company registration information, this government -backed fund was established on the 22nd and is larger than a similar fund launched in 2014. That fund raised approximately 139 billion yuan.
reported that the new fund is the latest sign of China’s determination to reduce its reliance on American technology.
reported that in the field of semiconductors, China still faces a long road to global dominance.
reported that the 2014 fund invested billions of dollars in dozens of projects. One of them is Yangtze Storage Technology Co., Ltd. The company said in September that it had begun mass production of an advanced memory chip called 64-layer 3D NAND flash memory.
reports that while the company is catching up quickly, it still lags behind industry leaders such as South Korea's Samsung Electronics that are already producing more advanced chips.
Overall, analysts believe China still lags behind industry leaders such as Intel and Samsung in key areas of semiconductor technology.
reported that in addition to chips, another major bottleneck in China's self-sufficiency efforts is chip manufacturing equipment, a field in which China does not dominate. Leading companies include Applied Materials and Lam Group in the United States, ASML Holdings in the Netherlands and Tokyo Electronics in Japan.
reported that Chinese customs data showed that China imported US$312.1 billion worth of semiconductor products in 2018, exceeding US$240.3 billion in crude oil imports.
Mainland China is stepping up its efforts to sprint towards the semiconductor industry
From the perspective of domestic official policies, in early October the Ministry of Industry and Information Technology announced that it will actively deploy the research and development of new materials and next-generation product technologies to promote the development of industrial semiconductor materials, chips, devices and IGBT module industries. At the same time, the Ministry of Industry and Information Technology will also launch the second phase of the National Integrated Circuit Fund to further promote the integration and reorganization of domestic and foreign semiconductor resources. Unlike the first phase, which focuses on integrated circuit design and manufacturing, the second phase of the fund will focus on the deployment of semiconductor equipment, materials, and application end , the plan is carried out by supporting industry leaders, developing parks to gather funds, and subsidizing China's industrial chain. This all declares that China will continue to support the development of the semiconductor industry with policies.
From the perspective of the development of Chinese semiconductor companies, effective R&D investment in technology dividends is an effective means to establish an independent core technology system. That is, continuous and efficient R&D investment is the real internal driving force for the growth of technology companies. In addition to investing in the expansion of advanced packaging technology production capacity in packaging and testing, especially Bumping, WLCSP, etc., Chinese semiconductor companies are preparing for the upcoming 5G communications and Internet of Things development opportunities, and in terms of foundry, they are striving to carry out 14nm production by the end of 2019. FinFET mass production plan, while 12nm process development has entered the customer introduction stage.
Memory manufacturing has also seen early results from Chinese companies. In addition to Yangtze Memory, which mass-produced 64-layer NAND Flash in September and plans to mass-produce DRAM in 2021, Hefei Changxin Memory mass-produced 19nm at the end of 2019. DDR4 and LP DDR4 DRAM; in addition, in terms of integrated circuit design, in addition to Chinese companies continuing to actively seek breakthroughs in CPU, GPU, FPGA, analog IC, EDA, etc., AI chips seem to have become the next battlefield for the US-China 5G hegemony.
html The first artificial intelligence inference chip "Hanguang 800" unveiled by Pingtou Ge in September, regardless of whether its real performance can match that of international players, Chinese companies are still trying to build a comprehensive end-to-cloud chip ecosystem. Metaphor.The hardware cornerstone of China's semiconductors is independently controllable. Local breakthroughs are accelerating. However, it is still undeniable that the wafer foundry and memory manufacturing processes are still lagging behind the world's leading echelons, and the patents and technologies of key core chips are not to be taken lightly. Breaking through the high threshold set by major international manufacturers.
Fortunately, China has a huge number of practical applications. Moreover, the demand for semiconductor products in the downstream Internet of Things, automotive electronics, 5G terminals and other fields will directly promote the technological and industrial upgrading of Chinese semiconductor companies. plus electronic components are strong, so Breakthroughs in the core of upstream semiconductors will be the general trend in the medium to long term.
*Disclaimer: This article is originally created by the author. The content of the article is the personal opinion of the author. The reprinting by Semiconductor Industry Watch is only to convey a different point of view. It does not mean that Semiconductor Industry Watch agrees or supports the view. If you have any objections, please contact Semiconductor Industry Watch.
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