According to Taiwan media reports, the packaging and testing factory of Pan- Guoji Group consumer CMOS image sensor (CIS) Tongxindian announced that it would merge the automotive CIS packaging and testing factory Shengli through share exchange.
It is understood that Panguoji Group is an investment alliance composed of Guoji Group, Qilixin Group and Zhibao Kaimei Group. The group has launched large-scale mergers and acquisitions and integration work since 2017. It shows that Tongxindian was established in April 1973. It is a leading manufacturer of niche polycrystalline module packaging in Taiwan. It is mainly engaged in the construction of ceramic circuit boards (LED heat dissipation substrates), high-frequency wireless communication modules (PA modules), hybrid integrated circuit modules (MEMS packages), system integration modules (SIPs) and image sensors. It is currently the largest ceramic circuit board manufacturer in Taiwan. Shengli, which was acquired by
, was established in 1991. In the early days, it mainly engaged in the sales of memory products and the packaging and testing of CMOS image sensors. After acquiring a company in 2015, it obtained CMOS image sensor and Memory packaging and testing technology, focusing mainly on the CIS business field for automotive and security purposes. It is also a designated partner of CIS manufacturers such as Sony and Howie.
Guoju and Tongxindian Chairman Chen Taiming said that it is expected that CMOS will be very tight in the next 2 and 3 years, and Tongxindian production capacity is almost full; Tongxindian and Shengli are the leading manufacturers of mobile phone and automotive CIS packaging and testing respectively. After the acquisition, the two strong teams are expected to form the world's largest CMOS packaging and testing factory besides the IDM factory.
Regarding the merger and acquisition case, the general manager of Tongxindian pointed out that due to the low overlap between the customers of both parties, Tongxindian's main markets are in mainland China and Europe, while Shengli's customer base is concentrated in the United States and Japan. It is expected that there will be intuitive performance feedback by 2020. Tongxindian will benefit from the trend of multi-lens mobile phones next year, and the sensor growth momentum is strong. After the merger of Shengli, image sensors will become the largest product line, and their performance is expected to reach double-digit growth for several years. The production capacity of both parties is already full, and production will continue to expand next year.
, Chairman of Shengli, Liu Fuzhou, said that Tongxindian's CIS business is mainly mobile phone applications and is the largest manufacturer outside the IDM factory. Shengli has transformed from consumer electronics and entered the automotive field. Currently, the market share of automotive CIS exceeds 70%, making it the largest manufacturer of automotive CIS packaging. The focus of cooperation with Tongxindian's strategy is to complement the industry. The gross profit of mobile phone CIS packaging is very good. The next major application development of CIS lies in 3D sensing. Tongxindian itself has system-level packaging (SiP) technology. Considering the long-term development of the industry and the combined effect, it is optimistic that the two parties will become the world's largest CMOS packaging and testing factory after the combination.
CIS is the limelight and the popularity of
International e-commerce only reported the news that Sony image sensors are in short supply last week. Since CIS accounts for the highest proportion of cameras in all aspects, reaching 52%, driven by the multi-camera design of mobile phones, the demand for CIS has ushered in explosive growth, which has led to some out of stock and price increases.
At present, domestic mainstream mobile phone manufacturers such as Huawei , Apple, Xiaomi , etc. have changed from two front and rear cameras to 3 to 5 cameras today. This trend of multi-camera is still spreading, and major mobile phone manufacturers are still continuing to make efforts in the design of multi-camera. It is expected that related demand will still exist in the next few years. In addition to the sharp increase in the number of cameras used on mobile phones, the demand for cameras in the automotive electronics and smart security markets is also growing. Faced with the growth of demand, upstream fabs are still in short supply, and price increases have begun to occur in the downstream packaging and testing process. Among the global CIS manufacturers, Sony, Samsung, and Beijing Howie are currently ranked in the top three, with SK Hynix, ON Semiconductor and STMicroelectronics following closely. Among these manufacturers, except for Howie, it is Fabless, the rest are IDM factories, and the products are all produced in their own factories.
