EVGA reveals that its first AMD Ryzen motherboard
Recently, EVGA disclosed that it will launch its motherboard based on AMD chipset for the first time, affiliated to the top DARK series.
Now, Vince "Kingpin" Lucido, the top product expert of EVGA, has exposed spy photos of the first EVGA AMD motherboard. There are only the back and IO bezels, and there are no details to see, but the huge DARK logo is clearly visible, and there are also Wi-Fi dual antennas.
Before guessing that EVGA might have to wait until the Zen4 architecture and 600 series motherboards come out before embracing AMD, but obviously I can't wait. I first went on the latest X570S. The biggest change compared to the original X570 is that it reduces power consumption and heat generation, and no fan is needed to dissipate heat.
Interestingly, EVGA released the Z590 DARK motherboard half a year ago, supporting Intel 10/11 generation Core, but it has not been launched yet. It is estimated that this X570S DARK will also borrow a lot of design elements, such as top-level power supply, cooling, overclocking, etc.
Huami released Huangshan 2S self-developed chip
This afternoon, Huami Technology launched the self-developed chip Huangshan 2S chip, which further upgraded performance, energy efficiency, heat control, etc., and was used together in the new generation of Huami watches.
At the press conference, Zhao Yajun, co-founder of Huami Technology, introduced the self-development path of Huami chips. He started to make plans in 2015. In 2018, he invested in SiFive, which invented the RISC-V instruction set, and released the Huangshan No. 1 and Huangshan No. 2 chips respectively in 2019 and 2020. Now Huangshan 2S is here.
According to Huami, Huangshan 2S adopts a dual-core RISC-V architecture, which is the first wearable artificial intelligence processor using a dual-core RISC-V architecture. The super powerful core computing performance can support high-load computing such as graphics and UI operations. The large-core system also integrates FPUs to support floating-point computing, which has a performance of 18% higher than that of Huangshan 2, a 56% reduction in operating power consumption, and a 93% reduction in sleep power consumption.
In addition to the CPU architecture upgrade, a major innovation of Huangshan 2S this time is that it brings independent GPUs to wearable chips for the first time, with relevant instructions for independent and efficient processing of graphics, making the graphics system of wearable devices smoother. The GPU graphics performance is 67% higher than that of Huangshan No. 2, and the performance gap is very obvious.
In AI artificial intelligence, Huangshan 2S is also equipped with a convolutional neural network acceleration processing unit, which can quickly identify disease types. Taking atrial fibrillation as an example, its recognition speed is 26 times that of pure software calculations.
It is reported that Huangshan 2S has successfully filmed in March this year and will become one of the core chips of the third-generation Amazfit smart watch.
RTX 30 Super for Intel 12th generation Core notebooks came
At the beginning of this year, NVIDIA launched the RTX 30 series mobile graphics card including RTX 3080, RTX 3070 and RTX 3060, and then launched the RTX 3050 and RTX 3050 Ti, both based on the Ampere architecture.
According to a new report, NVIDIA RTX 30 mobile graphics card will continue to expand its "Super" series product line. The "Super" series was used on the previous generation of RTX 20 series graphics cards.
foreign media reported that NVIDIA will launch mobile graphics cards codenamed "GA103S" and "GA107S" early next year.
As for the current known information, the code name GA103S may be an RTX 3080 Super, with up to 60 streaming multiprocessor arrays, up to 7680 CUDA cores, a memory bit width of 320 bits, and a memory using 10GB or 20GB GDDR6X.
GA107S mobile graphics card has not been exposed for more information, and the positioning may be between the RTX 3060 and RTX 3050 Ti.
rumored that NVIDIA's two RTX 30 Super mobile graphics cards are used to match Intel's upcoming 12th-generation Alder Lake-P Core mobile processor.
Huawei P50 rear camera specifications are exposed
According to recent revelations from multiple parties, it can be basically confirmed that the Huawei P50 series will be released on July 29, and will also become the first flagship model directly pre-installed with the Hongmeng system. Recently, a well-known overseas whistleblower @Teme (Teme) exposed the detailed specifications of the rear camera of Huawei P50 series.
According to reports, Huawei P50 will adopt a triple camera solution, the main camera adopts the latest upgraded IMX707 sensor, and is also equipped with an IMX600 lens, which should be ultra-wide angle, and also has a 3x telephoto lens.
Previously, it was reported that the IMX707 sensor has a 1/1.28-inch super large bottom, 5,000 pixels, and supports four-in-one output 12.5 million pixels, a unit area of 2.44μm pictures, and an aperture of F/1.7.
Huawei P50 Pro goes a step further and upgrades to a four-camera combination, with specifications of IMX800+OV64A+5x periscope+new ToF sensors. The main camera IMX800 is Sony's largest bottom sensor in history, with a 1/1.18-inch super large bottom, which can bring a qualitative improvement to the camera's photography level, especially the night shooting performance is very worth looking forward to. In addition to the upgrade of the imaging system, the entire Huawei P50 series has cancelled the pill-type hole-hole screen solution in terms of appearance, and is equipped with a centered hole-punch screen. The standard version and Pro and Pro+ versions are direct screens and curved screen solutions respectively. The overall visual effect has been greatly improved compared to the past.
realme notebook configuration and price exposed
July 13th news, well-known whistleblower Onleaks released a rendering of realme's first notebook realmebook.
As shown in the figure, the realmebook adopts the popular narrow-frame design. The A and C sides are suspected to be made of metal, equipped with a USB-C interface and a 3.5mm headphone jack, which supports fingerprint recognition.
revealed that realme laptops are equipped with the 11th generation Intel Core processor, offering two options: i3 and i5. The screen size is 14 inches and the resolution is expected to be FHD+. The news also said that the realme notebook will be available in India in August, with a price of less than 40,000 Indian rupees (about 3,500 yuan), and is extremely competitive in the same level.
It is worth noting that realme notebooks may be unveiled in the country. Industry insiders pointed out that the COVID-19 pandemic has catalyzed the demand for online services such as online office and online education, and unexpectedly led to a significant recovery in the PC market.
In this context, realme has also seen market demand when launching laptops, and new products are worth looking forward to.
Redmi K50 series exposed
Redmi K series As one of the most popular products of the Redmi brand, it has always been favored by users for its extremely cost-effectiveness and super high configuration.
This year's K40 has performed particularly well due to its improvements in many previous shortcomings. Given the excellent performance of the K40 series, many people are now looking forward to the launch of the Redmi K50 series.
This morning, a well-known blogger brought the latest news about the phone, saying that Redmi has confirmed the network access model of the Redmi K50 series and is likely to be officially released before the Spring Festival.
According to previous relevant revelations, the Redmi K50 series has actually started internal planning. It is reported that the two iterative products of this series maintain a similar design style, and both use a 120hz single-hole screen solution on the front.
In addition, the news also said that the imaging systems of these two models will be upgraded compared to this year. In terms of specifications, one is equipped with a 108 million pixel main camera, and the other is a 48 million pixel main camera. However, it is revealed that the latter may also be a higher pixel synthesis effect, and the actual pixel will be higher. In terms of
configuration, high-end versions such as K50 Pro will inevitably be equipped with Qualcomm's new flagship Snapdragon 895 chip next year, and the K50 standard version may be equipped with an improved version of Snapdragon 888, similar to the current Snapdragon 870-positioned chip, which will be better controlled in terms of power consumption and heating.
