CoWoS, 2.5D/3D Advanced Packaging has become the key to the success of high-performance computing ASIC
Shanghai, July 7, 2022 /PRNewswire/ -- In recent years, Advanced Package has become the key to the success of high-performance computing custom chips (High Performance Computing ASICs). As market demand continues to escalate, Shixin Electronics is committed to investing in advanced packaging key technologies and integrating them more efficiently into the chip design supply chain to achieve a fully customized cooperation model.
With the development of the advanced application market, major technology system manufacturers must begin to achieve innovation through the integration of software and hardware systems, so that their products can achieve more powerful functions and enhanced system performance. Because of this, the demand for customized chips (ASICs) by various system manufacturers and OEMs is growing rapidly. Especially in the field of high-performance computing system chips (SoCs), IC design itself is very complex and costly. If back-end design includes packaging, testing, supply chain integration, etc., it will be a larger investment. With the consideration of cost and efficiency, it is an inevitable trend for major companies to choose to cooperate with professional high-end ASIC design companies.
High-performance computing ICSuccess depends on advanced packaging technology
High-performance computing in the high-end application market. The system chips are growing strongly, accompanied by unprecedented dependence on advanced packaging technology. Advanced packaging technologies developed by TSMC, CoWoS and InFO 2.5D/3D packaging are crucial to the successful deployment of today's HPC SoC ASICs. CoWoS packaging can achieve the ability to bond several chiplets to the same interposer and the same package substrate to achieve the state of "system-level miniaturization", greatly improving the interconnection density and performance between SoCs, and is a major breakthrough in the history of science and technology. Another advanced packaging technology is multi-chip module (MCM) which is also a similar concept. Unlike traditional packaging, advanced packaging needs to be more integrated with circuit design, and the need to integrate the middle and lower reaches of the industry is a major challenge to design integration capabilities and an investment with a very high threshold.
Advanced Package CoWoS, 2.5D Package - Shixin's high-performance computing design solutions can seamlessly integrate system chip design and advanced packaging technology, thereby improving interconnect density and performance
Shixin has seen the rapid growth of the demand for advanced packaging in the high-performance system computing ASIC design service market. "Now, various technology manufacturers are investing heavily in front-end IC design in order to perfectly combine with their own products to maximize the distinction and market leadership. What they need now is to cooperate with outstanding professional ASIC design service companies so that their large investment and time costs will not be put into full swing." said Shen Xianglin, president and CEO of Shixin Electronics.
Sinxin is an important partner for customers to customize chips in the high-performance computing market. The high-performance computing design solution provided by
Sinxin Electronics can seamlessly integrate high-performance computing system chip design and advanced packaging technology. Shixin's MCM was mass-produced in 2020 and CoWoS was mass-produced in 2021. The existing large-size system chips are almost the largest size of the mask (Reticle Size, 800mm2). Interposer is designed to be 3~4 times the maximum size of the mask (3~4X Reticle Size), and the advanced packaging size even reaches 85x85mm2, which is the limit of existing packaging technology. These have been successfully mass-produced by many customer products. It also proves that Shixin's high-performance computing design solutions meet the market demand of high-performance computing ICs and are an important key to its leading position in the market.
Shixin Electronics Co., Ltd. was established in 2003 and is headquartered in Taipei. Provides high-complexity, high-yield SoC design and mass production services for the system company. The product application market includes AI artificial intelligence, HPC high-performance computing, entertainment machines, mobile phones, communication equipment, computers and other consumer electronic IC products. Shixin is committed to providing customers with the highest efficiency/cost ratio solutions, ensuring that customers successfully submit their films in one go and quickly import products into the market.Since its establishment, Shixin has completed many high-end processes (below 16 nanometers), high-performance computing HPC SoC IC and advanced packaging (CoWoS, 2.5D), and was listed on the Taiwan Stock Exchange on October 28, 2014 (stock code: Shixin-KY: 3661). Currently, it has branches in the United States (Silicon Valley), Japan (Shinyokohama), mainland China (Shanghai, Wuxi, Hefei, Guangzhou, Jinan, Beijing) and Taiwan (Hsinchu), China.
