source: The content comes from "Economic Daily", thank you.
TSMC is sprinting towards advanced manufacturing processes below 5 nanometers, and Nanke Wafer Factory 18 is an important force. Tainan City Economic Development Bureau stated yesterday (12th) that TSMC Nanke 5-nanometer plant has now entered trial production and is expected to be mass-produced next year. Construction of the new 3-nanometer plant is expected to start next year, with a total investment in 5-nanometer and 3-nanometer The amount amounted to 1.15 trillion yuan.
TSMC emphasized that not only Nanke 18 Factory will be the flagship factory with the largest investment amount in the past, but in the future 5 nanometer and 3 nanometer will also become the most advanced processes that account for more than 50% of TSMC revenue. They are extremely important for Taiwan and the global semiconductor industry. production base. TSMC stock price rose 4 yuan yesterday to close at 305 yuan, with 2,390 foreign investors reselling; ADR fell about 0.1% in early trading on Tuesday.
The industry pointed out that TSMC advanced processes below 45 nanometers are building production capacity in stages. If resources such as Zhuke headquarters are included, TSMC The total investment amount below 45 nanometers is 1.5 trillion yuan, which is the largest investment in Taiwan in recent years.
As TSMC invests heavily in advanced process technology, it will help consolidate its position as the world's leading foundry and continue to widen the gap with Samsung , Intel and other competitors.
TSMC 5 nanometer and 3 nanometer investment plans are all concentrated in Nanke, which is listed as TSMC Nanke Wafer Factory 18. Construction started in January last year and is scheduled to be officially mass-produced next year. It will be the world's first wafer foundry providing 5-nanometer processes. The factory area for engineering services is expected to have three phases of factory buildings.
Executive President Su Zhenchang finalized the expansion of Nanjing University of Science and Technology's base in Tainan last week. The outside world is concerned about the progress of TSMC's investment project. The Tainan City Economic Development Bureau stated in a business report at the city meeting yesterday that the investment amount of TSMC 5 nanometer factory is about 550 billion yuan. It has entered the trial production stage in the first quarter of this year and the process is going smoothly. It is expected to be mass-produced next year, which can bring about 4,000 units. Employment Opportunities. The new 3-nanometer factory has an investment of approximately 600 billion yuan and is scheduled to be located at the northernmost end of the Nanke Park. Construction is expected to start next year and mass production will begin in 2022, creating approximately 5,000 jobs. The total investment amount of TSMC in Tainan for 5 nanometer and 3 nanometer is as high as 1.15 trillion yuan.
TSMC has completed the construction of the first and second phases of Nanke Wafer Factory 18, and has completed the installation and trial production. It will officially enter mass production next year. Taking into account the early deployment of fifth-generation mobile communications (5G), TSMC will be launched this year. Capital expenditures are being repaired, 5nm production capacity has been laid out in advance, and the construction of the third phase of Nanke Wafer Factory 18 is planned to be completed ahead of schedule and the 5nm enhanced version will be introduced. It is expected that capital expenditures will remain high next year, compared with US$14 billion to US$15 billion this year. quite.
packaging and testing plant may start construction next year
In addition to the wafer factory, the packaging and testing plant is also the focus of the next stage of TSMC
wafer foundry leader TSMC Zhunan Advanced Packaging and Testing Plant passed the environmental impact assessment review meeting on the 11th in principle. After the TSMC board of directors confirms and approves it, the final version will be sent before February 10 next year, and the Zhunan factory construction project can be officially launched in the first half of next year at the earliest. This factory will be the fifth advanced packaging and testing factory of TSMC , and will become the first packaging and testing factory tailored for 3D IC packaging technology.
TSMC currently has advanced packaging and testing plants in Zhuke, Zhongke, Nanke, Longtan and other places. The Miaoli Zhunan packaging and testing base will be the fifth advanced packaging and testing plant. The plant is expected to invest NT$300 billion. It is located in the designated area around Zhunan Science Park and Dabu. The base area is about 14.3 hectares. The environmental impact assessment process was launched in September last year. In August this year, it successfully passed the review of the environmental impact assessment team. On the 11th, it went through 13 All environmental impact assessment review committee members unanimously agreed to approve the case in principle.
TSMC must submit the final draft environmental impact statement before February 10 next year. After the review committee finalizes the draft, the operator must notify the competent authority, relevant units, and the public 30 days before construction to hold a public briefing and complete the application procedures. Wait, the factory construction is expected to be officially launched in the first half of next year at the earliest, and it is expected to provide more than 2,500 local job opportunities.
TSMC has successfully mass-produced 2.5D IC advanced packaging processes in recent years. Apple, Broadcom, Xilinx , MediaTek , Huawei HiSilicon, etc. are major customers, including providing a series of integrated fan-out (InFO) wafer-level packaging technology, and provides (CoWoS) packaging process for high-performance computing (HPC) chips.
TSMC has completed the research and development of 3D IC packaging technology, including wafer on wafer (WoW) and system integration single chip (SoIC). The industry expects that the Zhunan plant will focus on 3D IC packaging and testing production capacity in the future. , providing major customers with the use of packaging to complete heterogeneous chip integration.
