Help the Chinese chip market! Japanese companies intend to spend 140 million yuan to increase semiconductor packaging production capacity in China by 50%

2021/07/2720:05:42 finance 788

Help the Chinese chip market! Japanese companies intend to spend 140 million yuan to increase semiconductor packaging production capacity in China by 50% - DayDayNews

According to the latest media report on Tuesday (July 27), Japanese chip company Sumitomo Bakelite announced that plans to spend about 2.5 billion yen (equivalent to RMB 2.5 billion). The production capacity of semiconductor package of the Suzhou subsidiary in China has increased by 50% on the original basis. The energy-increasing production line has been under construction and is expected to be completed within one year of this year, and is expected to be put into production next year. The production line increases the semiconductor packaging capacity from 1,200 tons/month to 1,800 tons/month. 's new production line will be mainly targeted at the Chinese chip market after the completion of the new production line.

Help the Chinese chip market! Japanese companies intend to spend 140 million yuan to increase semiconductor packaging production capacity in China by 50% - DayDayNews

The demand for materials will continue to be hot, and while observing the market's response, prepare for energy increase.

Help the Chinese chip market! Japanese companies intend to spend 140 million yuan to increase semiconductor packaging production capacity in China by 50% - DayDayNews

, indeed In the global semiconductor packaging and testing business, China's business ranking is very high. Statistics show that in 2020, the scale of my country's integrated circuit packaging and testing industry will reach 251 billion yuan, an increase of 6.8% compared with last year. Seeing such a big piece of "cake", Japanese companies will inevitably stretch out their hands. Asakuma Juntoshi said that in order to improve competitiveness, he will not hesitate to adopt some methods that can improve production efficiency.

Help the Chinese chip market! Japanese companies intend to spend 140 million yuan to increase semiconductor packaging production capacity in China by 50% - DayDayNews

As early as May last year, Changjiang Electronics Technology, a leading chip packaging and testing company in my country, has broken through the predicament of packaging technology "jamming" and successfully developed a higher-density double-sided packaging SiP process, which can reduce trial and error costs and shorten the time.

Currently, Changjiang Electronics Technology ranks among the top 3 in the ranking of global semiconductor packaging and testing companies, ranking third. statistics show that has the highest share of advanced packaging wafers in the world is Intel ,Accounting for 12.4%, the second place is Silicon Products, which accounted for 11.6%, and Changjiang Electronics Technology accounted for 7.8%. The Chinese company has also set a very "hard gas" goal to become the world's largest semiconductor packaging and testing plant by 2022.


Text | Zhang Jianlin Title | Xu Xiaobing Figure | Lu Wenxiang Review | Lu Jiamin

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