Author: Wang Xin Source: IT Times
Pat Kissinger presented Intel's first lifelong achievement innovation award to Linus Torvalds, the "father of Linux"
. A black T-shirt and jeans, Intel CEO Pat Kissinger has a series of new products and technologies at the 2022 Intel On Technology Innovation Summit, with the "best and fastest desktop processor ever" Core i9- 13900K, there is also the GPU that Kissinger was thinking about when he left Intel 12 years ago, as well as the latest progress in chip foundry and industrial ecosystem construction, and his firm confidence in Moore's Law to continue running for 10 years...
If all this is to be summarized into one sentence, then the sentence on Pat Kissinger's T-shirt is undoubtedly the most appropriate. It is a special expression mixed with English and binary ASCII encoding, which means "bring back the geek spirit"! This seems to mean that the company that "brings silicon into Silicon Valley " more than 50 years ago will continue to focus on technology, and the five "super technical forces" that Intel is pursuing are computing, connectivity, infrastructure, artificial intelligence , sensing and perception.
A new pattern of wafer foundry is coming?
In the conference keynote speech, Pat Kissinger reiterated Intel's firm belief in the open ecosystem - to carry out open innovation in future technologies, providing options, helping to promote the industry to form standards, and providing solutions that can be trusted.
It is obvious that in Intel's chip foundry strategy, openness and ecology are two keywords that cannot be avoided. Kissinger said that Intel will become a great wafer foundry, meeting the growing demand for semiconductor , bringing more production capacity to the world, and creating more value for customers. "After acquiring Tower Semiconductor, Intel Foundry Services will become a comprehensive end-to-end foundry in the world, providing one of the industry's widest differentiated technology portfolios."
Intel expects that Foundry Services will usher in the era of "system-level foundry", which is a huge paradigm shift. Intel's center of gravity shifts from system chips to systems in packaging. Wafer manufacturing is only one of the components of "system-level foundry", and the other three components are packaging, software and an open chiplet ecosystem.
Regarding Intel's big strides in the field of chip foundry, global industry leaders TSMC and Samsung seem to have an open attitude towards competing with . Executives from Samsung and TSMC have joined Pat Kissinger’s keynote and support for the General Plug High-speed Interconnect Open Specification (UCIe) Alliance, an Intel-led alliance to create an open ecosystem where chips designed and produced by different suppliers with different process technologies can be integrated and operated together through advanced packaging technologies.
Data shows that the three major chip manufacturers and more than 80 leading semiconductor industry companies have joined the UCIe alliance. Pat Kissinger said the UCIe alliance is making (different core fusion packages) a reality.
In terms of chip packaging technology, Intel also previewed an innovation under development. This is a breakthrough based on optical interconnection technology, enabling pluggable optoelectronic co-packaging, allowing the bandwidth between chips to reach a higher level, especially within the data center. To solve this problem, Intel researchers designed a rugged, high-yield, glass-based solution that simplifies the manufacturing process with a pluggable connector, reduces costs, and opens up new possibilities for future new systems and chip package architecture.
Moore's Law is still valid within ten years
In the era of brand new chip "system-level foundry", Intel said that it will also maintain a large span in wafer manufacturing. Does Moore's Law continue to be effective? Regarding topics that people around the world are very concerned about, Pat Kissinger believes that combining RibbonFET and PowerVia two breakthrough technologies, as well as advanced technologies such as High-NA lithography machines, Intel hopes to have 1 trillion transistors in a chip package by 2030.
"Intel has made a bold plan to deliver 5 process nodes within 4 years." Pat Kissinger said, "Intel 18A process PDK 0.3 version has now been adopted by early design customers. The test chip is being designed and will be cut at the end of the year. Moore's Law - it will still be effective in at least the next decade!" What is the limit of the chip process? Intel believes that infinite possibilities are hidden in of the periodic table of . When releasing the magical power of silicon, Intel needs the courage to move forward in geeks.
Core i9-13900K maximum turbo frequency 5.8 GHz
The most eye-catching consumer-grade product of the 2022 Intel On Technology Innovation Summit is the 13th generation Intel Core i9-13900K processor and the Ruixuan A770 GPU with a starting price of $329.
"The new 13th generation Intel Core flagship processor has once again improved the benchmark of PC performance." Michelle Johnston Holthaus, executive vice president and general manager of the client computing division of Intel, said confidently.
The Core i9-13900K processor uses the mature Intel 7 process technology and x86 high-performance hybrid architecture, with up to 24 cores (8 performance cores, 16 energy efficiency cores) and 32 threads. Its single-threaded performance and multi-threaded performance have increased by up to 15% and 41%, respectively, and up to turbo frequency of 5.8 GHz.
For gamers, the Intel Ruixuan A770 will be available on October 12 with a starting price of $329 and a variety of product designs, providing excellent content creation and 1440p gaming performance. Judging from the positioning of this consumer-grade GPU, it is aimed at mid-to-high-end graphics cards for gamers.
Ecological
provides developers with a complete development environment and technical support, which is something Intel has been doing without any effort. Pat Kissinger cited a range of challenges faced by developers, such as supplier lockdown, acquisition of new hardware, productivity, time to market and security issues.
Recently, a new developer platform, Intel Developer Cloud Platform, is launching a small-scale attempt to enable developers and partners to obtain Intel technology earlier and more efficiently, as early as a few months before the product goes on the market or even a whole year. Customers and developers participating in the test can test and verify Intel's newest platforms in the coming weeks, including the Xeon series processor, the Habana Gaudi 2 deep learning accelerator, data center GPU and data center GPU Flex series, etc. Now this AI and cloud computing developer provides a truly seamless development environment and premise, allowing software and hardware development to always be "one step ahead".
At the same time, the new collaborative Intel Geti computer vision platform helps to quickly and easily develop effective AI models deep in the data center, in line with GPU products such as Intel CPUs. Geti helps development teams reduce the time required for model development and reduces the technical threshold and development costs of AI development through a single interface for data upload, annotation, model training and retraining. It is worth mentioning that the platform also has optimization functions for OpenVINO built-in, and the development team can also deploy high-quality computer vision AI solutions in their enterprises, which reflects the completeness, systematization and consistency of the Intel development ecosystem.
