EDA giant Ansys and chip foundry leader TSMC have expanded their long-term partnership and announced that Ansys power integrity software has passed TSMC's industry-leading N4P and N3E process technology certifications. Ansys RedHawk-SC and Totem certification support next-generat

2024/05/1400:18:33 technology 1659

EDA giant Ansys and chip foundry leader TSMC have expanded their long-term partnership and announced that Ansys power integrity software has passed TSMC's industry-leading N4P and N3E process technology certifications. Ansys RedHawk-SC and Totem certification support next-generat - DayDayNews

EDA major Ansys (Ansys) and chip foundry leader TSMC have expanded their long-term partnership and announced that Ansys power integrity software has passed TSMC’s industry-leading N4P and N3E process technology certifications. Ansys RedHawk-SC and Totem certification support next-generation silicon design for machine learning, 5G mobile communications, and high-performance computing (HPC) applications. The Ansys platform has recently obtained TSMC N4 and N3 process certification, laying the foundation for this latest cooperation.

Suk Lee, Vice President of TSMC's Design and Build Management Division, said, "Our latest cooperation with Ansys provides design solutions for our mutual customers, and our latest advanced technology can significantly improve the power consumption and performance of these solutions." We work closely with ecosystem partners to ensure customers have timely and reliable power integrity design and analysis solutions to accelerate the innovation of their market segmentation -based products.

Ansys RedHawk-SC and Ansys Totem have always been the most popular power integrity verification solutions for many of the world's leading chip design projects. Industry-leading solutions help designers sign off voltage drop, power supply noise, and electromigration reliability with accurate predictions down to 3nm. Powerful analysis capabilities help quickly identify weaknesses and explore alternatives to optimize power and performance.

John Lee, Ansys vice president and general manager of the semiconductor, electronics, and optics business unit, said that Ansys has developed an integrated multi-physics simulation and analysis tool software platform that can quickly solve the power management challenges of today's ultra-large and complex chip designs. Through our cooperation with TSMC, Ansys products are at the forefront of silicon chip technology, helping designers maximize the benefits of the latest process innovation.

(first image source: official website)

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