Wave soldering flux is the main electronic auxiliary material used to electronic assembly PCBA processing . The quality directly determines the reliability of subsequent products. The following is a brief description of the role of flux in wave soldering . Jiangxi Inteli Electronic Technology Co., Ltd. was established in May 2016. The company is headquartered in Linchuan High-tech Industrial Park, Fuzhou City, Jiangxi Province. The company independently develops DC and AC charging piles and energy storage products, and also provides one-stop EMS services for the new energy and industrial industries. It has a factory area of 30,000 square meters, 24 SMT production lines, 8 plug-in lines, 4 wave soldering lines, 8 assembly lines, and 4 packaging lines, with a total investment of 1 billion yuan, equipped with an advanced and complete digital management system, and is committed to building excellent ODMs in the charging and energy storage industries, as well as EMS Industry 4.0 smart factory.
① Remove the rust film on the surface of the welded metal. The rust film on the surface of the welded metal is usually insoluble in any solution, but these rusts react chemically with certain materials to form compounds that can be soluble in liquid explosive aids, which can remove the rust film and achieve the purpose of purifying the surface of the welded metal. This chemical reaction can be another compound that causes the flux and the rust film to form a flux or flux solvent, or it can be a chemical reaction to reduce the metal rust film to a pure metal surface. The fluxes belonging to the first chemical reaction are mainly represented by rosin-type fluxes. As an example of the second chemical reaction, some reducing gases are used. For example, oxygen can reduce oxides on the metal surface at high temperatures, generate water and restore a pure metal surface.
② Prevent secondary oxidation of welding metal during heating. During wave soldering, as the temperature increases, the reoxidation phenomenon of the metal surface will intensify. Therefore, the flux must provide protection for the purified metal surface, that is, the flux should form a thin film on the entire metal surface to cover the metal and isolate it from the air, so as to prevent the secondary oxidation of the soldered metal during the heating process of welding.
③Reduce the surface tension of liquid solder. The flux during the welding process can affect the energy balance of the surface by promoting the spread of solder, reduce the surface tension of the liquid solder, and reduce the contact angle.
④Heat transfer. There are generally many gaps in the welded joints. During the welding process, the air in these gaps plays a role in separating, resulting in poor heat transfer. If these gaps are filled with flux, the transfer of heat can be accelerated and the speed reaches thermal equilibrium .
⑤ Promote the diffusion of liquid solder. After the preheated viscous flux contacts the wave solder, the activity increases dramatically and the viscosity decreases sharply. A second diffusion flow is formed on the surface of the welded metal and quickly spreads on the surface of the welded metal. The drifting force formed by the secondary drifting process of flux is attached to the liquid solder, thereby dragging the drifting process of liquid metal.
The dragging effect of secondary diffusion of solder on liquid solder
The flux coating system automatically and efficiently applies the flux to the soldered surface of the PCB, uses the flux to break the oxide layer, remove the loose oxide layer from the metal surface, and make the solder and the base metal come into direct contact.