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In the past two years, due to the increase in demand, the market demand for CIS has risen.
It is reported that the supply of CMOS image sensing elements (CIS) is in short supply, mainly because the demand for smart phones has increased significantly, the number of lenses has increased to more than 3, and the demand for automotive CMOS sensing elements continues to grow.
is in short supply. Market insiders said that Chinese manufacturer Omnivision has reported a 10% to 20% increase in price, and plans to expand the production capacity of high-end CMOS sensing components, from 50,000 pieces per month to 70,000 pieces, which is estimated to include high, medium and low-end product lines, with monthly production capacity increasing to 110,000 pieces.
In addition, Sony image sensors are in short supply, and even if they are continuously produced 24 hours a day, they are still not enough to meet market demand. Sony has invested a lot of money to plan to double its production capacity, and the new Nagasaki plant is planned to be operated in April 2021.
has also driven the demand for related supply chains, including closed beta testing. According to analysts, Huatian Technology recently obtained the CIS-TSV packaging technology license from Israel shallcase, and is deployed in 12-inch wafer silicon perforation (CIS-TSV) packaging. In the fourth quarter of 2019, the Kunshan factory's CIS-TSV packaging manufacturing benefited from the increase in the price of the foundry fee. This is expected to help their packaging and testing business take a new level.
According to relevant data, integrated circuit packaging technology (3D IC) based on TSV technology based on three-dimensional direction stacking is the latest packaging technology, with the advantages of minimum size and quality, effectively reducing parasitic effects, improving chip speed and reducing power consumption. TSV technology is the latest technology to achieve the interconnection between chips by making vertical conduction between chips. Since the first exhibition of the small image sensor module in wafer-level packaging using TSV technology by Toshiba in Japan in March 2007, this technology has continuously attracted major image sensor manufacturers around the world to invest in the ranks of photography modules made with TSV. Relevant people from
said that the emergence of this technology is expected to help Huatian Technology challenge the leading manufacturers of CIS packaging in Taiwan. However, market insiders in the greedy market pointed out that although Chinese manufacturers actively deploy CIS packaging, Taiwan manufacturers Tongxindian, Jingyuandian and Precision Materials still occupy a leading position.
, Tongxindian mainly produces wafer recombination (RW) and configuration of CMOS sensing components, and carefully layout CIS wafer-level size packaging (CIS CSP). Jingyuandian mainly conducts CIS wafer testing. Chen Taiming, chairman of
Tongxindian, said recently that after the merger with Shengli, it is expected to become the largest supplier of professional packaging and testing OEM for CMOS image sensing components in addition to Japan's Sony and South Korea's Samsung (Samsung).
is currently fully loaded with a monthly capacity of about 80,000 pieces. It is estimated that the monthly capacity of the first quarter will increase to 100,000 pieces. It is planned to double the monthly capacity at the end of this year, and grow to 150,000 pieces to 160,000 pieces.
fine material previously stated that the demand for wafer-level packaging of image sensing components has increased. The image sensing packaging in the first half of this year will be better than the same period in 2019. Currently, the fine material CIS wafer-level packaging is mainly based on 8-inch production capacity.
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