The most popular topic among Asian fruit fans recently is " iPhone 6s TSMC and Samsung A9 processors have different performance and endurance performance. Netizens tested the A9 processors produced by TSMC and Samsung. In terms of performance running scores or the battery life of the mobile phone, the 16-nanometer TSMC A9 processor obviously beats the 14-nanometer Samsung A9 processor (see here for details on the test status). ), although Apple has officially stated that the A9 chips shipped by different foundries meet Apple standards, and according to the official test, the difference between the two is only between 2-3%, it seems that the doubts of fruit fans in Asia cannot be calmed down. Hong Kong Apple fans have even planned to replace or withdraw the machine.
Samsung uses the newer 14-nanometer process, which is not only cost-effective, but also beats the 16-nanometer process used by TSMC. However, in terms of actual performance measurement results, whether it is the actual battery life between 2-3% certified by Apple or the nearly two-hour difference measured by netizens, it is an indisputable fact that TSMC's OEM A9 processor is better than Samsung's OEM A9 processor. Why does TSMC 16-nanometer A9 processor beat Samsung 14nm A9 processor? The following is a compilation of relevant information on the network and personal insights from the moderator for your reference.
1. What is the process of FinFET?
FinFET(Fin Field-Effect Transistor, a fin field-effect transistor, is a new type of multi-gate gate 3D transistor, which was invented by Hu Zhengming, a professor of Berkeley Electric, who was once a technical expert in TSMC. FinFET originated from an innovative design of the current standard transistor -field-effect transistor (FET). In a traditional transistor structure, the gate that controls current through can only control the circuit turn-on and Disconnection belongs to a planar architecture. In the FinFET architecture, the gate is a fork-shaped 3D architecture similar to a fish fin, which can control the on and off of the circuit on both sides of the circuit. This design can greatly improve circuit control and reduce leakage current, and can also greatly shorten the gate length of the transistor.
Image source: eettaiwan
According to Samsung's official statement, Samsung The 14nmFinFET process will perform better on Low Vdd and Less Delay than TSMC 20nm Planner.
Samsung 14nmFinFET process compared with TSMC 16nm FinFET process, Samsung's 14nm process crystal Die Size is smaller, and at the same yield rate, the cost will be more advantageous. Ptt Internet reports that TSMC's A9 chip price is about US$22, Samsung's quotation may be 30% to 50%, and moderators believe that Samsung's quotation may be 10~20%. However, because Samsung's yield rate is not as good as TSMC, Samsung's supply cannot meet Apple's large supply demand, and the two companies' current supply proportion to Apple is still comparable.
picture Source: Chipworks
2. Why does Samsung's 14nm lose to TSMC 16nm?
A. Samsung's semiconductor process technology surpasses TSMC's whole story:
Samsung Electronics' semiconductor process technology was called "a small point on the radar" by TSMC Chairman Zhang Zhongmou , but Samsung has started mass production of 14nm in early December 2014 FinFET technology chips are ahead of TSMC for at least half a year, shocking the entire semiconductor industry. The key to Samsung's great leap forward in semiconductor process technology is closely related to the resignation of TSMC's R&D department, Liang Mengsong, and the resignation of Samsung in South Korea.
Liang Mengsong is a Ph.D. in the University of California, Berkeley. During his 17 years at TSMC, he has made great achievements. He is the inventor of nearly 500 patents of TSMC. He is responsible for or participates in the most advanced technology of TSMC's every generation of processes. One of Liang Mengsong's strengths is the FinFET technology that TSMC competes fiercely with Samsung, which is related to his mentor and doctoral supervisor, who is the inventor of FinFET ~ Professor Hu Zhengming. Due to dissatisfaction with the arrangements for transferring to the "Moore's Law Plan", Liang Mengsong chose to join the enemy camp in 2009. Originally, Samsung's product technology originated from IBM. With the guidance and assistance of Liang Mengsong, the differences between Samsung's 45nm, 32nm and 28nm generations and TSMC have rapidly decreased.
According to a "TSIMC/Samsung/IBM product key process structure analysis and comparison report" commissioned by TSMC, several key process characteristics of Samsung are very similar to TSMC. The FinFET products mass-produced by both parties may not be distinguished from Samsung or TSMC from structural analysis alone. Therefore, TSMC determined that "Liang Mengsong should have leaked TSMC's business secrets to use for Samsung" and filed a legal lawsuit. The judge of the second instance court agreed to TSMC's request, "In order to prevent the leakage of TSMC's business secrets", Liang Mengsong will not provide services to Samsung through office or other means from December 31, 2015. Liang Mengsong has appealed to the Supreme Court. On the other hand, TSMC has recovered Jiang Shangyi, the eldest brother of TSMC R&D, who has retired twice, as the chairman's consultant, with the goal of making TSMC 7 nanometers the world's most advanced.
Image source: World Magazine
B. Why does Samsung FinFET's performance and yield lose to TSMC:
Samsung A9 processor not only loses to TSMC in terms of performance and battery life, but media reports that Samsung and Grossfield cooperate with A9 chip yield is only 30%, far behind TSMC. Before staking TSMC, Samsung Electronics' research and development leaders and its subordinates, its key process technology originated from TSMC and was leading the use of more advanced processes, but why did its actual performance and yield lose to TSMC?
Compared with TSMC's chip manufacturing process, it evolved step by step from 28nm 20nm Planner 16nm FinFET, while Samsung directly jumped from 32nm/28nm Planner technology to 14nm FinFET technology. Since semiconductor FinFET technology is different from the past 2D plane technology experience, FinFET must overcome many challenges in all aspects of process, design, IP and electronic design automation (EDA) tools before it can mature. In terms of results theory, Samsung seems to have not yet matured to master the new technology of FinFET, especially in yield and leakage control. Although Samsung has poached TSMC's FinFET technology competitors, senior executives usually only remember the general direction. The hard work of preventing leakage and improving yields still depends on the large number of high-quality and young livers at the grassroots level. This is still TSMC's strength at present. The difference in the performance of the two companies' products, taking running as an example, although Samsung is better than TSMC, it is always running, and ultimately loses to TSMC, which is a direct running.
However, having said that, the performance of Samsung A9 is still recognized by Apple. It is not that Samsung A9 is not good, but that TSMC is doing too well. Based on cost considerations and Apple's past style, Samsung still gains the upper hand in the competition for A9 processor orders. Although TSMC temporarily prevents Liang Mengsong from officially working at Samsung through legal means, the damage caused by the poaching of key talents has been caused by the gap in the original technology, and TSMC will still face great challenges and severe tests between Samsung and China. How TSMC makes good use of Jiang Shangyi's guidance and the accumulated experience and foundation over the past decades to make TSMC 7nm the world's most advanced as soon as possible will be TSMC's way out of Samsung's struggle.
