On April 23, 2022, School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, 70th Anniversary School Celebration Series Cloud Salon (Third: Power Electronics and Electric Power Transmission) was held online. Associate Researcher at of Huazhong University of Science and Technology was invited to give a report on "Research on the Integration Technology of Wide Band-gate Semiconductor Packaging ". Now I will share the report of Associate Researcher Chen Cai with readers in order to promote academic exchanges and technological progress in this field.
Expert Profile
Chen Cai, associate researcher at Huazhong University of Science and Technology, and doctoral supervisor. He published 14 SCI papers as the first or corresponding author , authorized and applied for 30 first inventor patents, and achieved the transformation of 6 million yuan in scientific and technological achievements and won the silver award of the Geneva International Invention Exhibition; he presided over 2 National Natural Science Foundation projects (1 excellent conclusion), participated in 5 national key projects, and presided over or focused on researching enterprise cooperation projects. The research direction is wide bandgap semiconductor package integration.
report excerpt
wide bandgap semiconductor has significant advantages and wide application prospects compared to traditional silicon-based devices, and is the focus of global semiconductor technology and industry competition.
1) has carried out research on the integration of the integration of the bottom device packaging to topology and control to the top-level system, and has made some theoretical and methodological progress in low-sensing, low-thermal resistance packaging, high-frequency and high-efficiency topology and control, and packaging-based system integration methods, helping to the large-scale application of wide bandgap semiconductor devices.
2) The model of traditional power electronic engineers using shelf products for power supply design may become a new model of development from underlying packaging and even chips, and will increasingly use the processes and materials used in the semiconductor manufacturing industry. Interdisciplinary teams and composite talents will be the key to future power electronic technology research.
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