On June 17, TSMC unveiled a number of advanced technologies at the 2022 Technical Seminar, including some new breakthroughs in FINFLEX technology, N2 technology, ultra-low power platforms and 3D Fabric advanced packaging technology.

6 On June 17, TSMC disclosed a number of advanced technologies at the 2022 Technical Seminar, including some new breakthroughs in FINFLEX technology, N2 technology, ultra-low power platforms and 3D Fabric advanced packaging technology. The most eye-catching one is the "N2 (2nm)" process technology that has entered the next stage.

According to TSMC, N2 uses a new "Nanosheet (Nanosheet)" technology instead of the previous "FinFET (Fin Transistor)" technology; chips born under this process have better performance under the same power. The speed can be increased by 10%~15%, while the power consumption can be reduced by 25%~30% at the same speed, further improving the energy efficiency of compared to . The new technology

will not only be provided for mobile platforms, but may also appear on high-performance processors or graphics cards. However, TSMC also stated that the N2 process will not be officially put into production before the end of 2025. It seems unlikely that we will see related products in the past two years.

In addition, the FINFLEX technology announced this time is also worthy of attention. This new technology brings more N3 process designs, including new processes such as N3E, N3P, N3S and N3X, with higher "design flexibility" to meet different needs.