Huawei releases the world’s fastest AI training cluster to tap into the 2 trillion market. On September 18, Huawei’s Full Connection Conference opened and the AI ​​product Atlas900 was officially released. Hu Houkun, Huawei’s rotating chairman, called it “the fastest AI training

Huawei releases the world’s fastest AI training cluster Nuggets 2 trillion market

On September 18, Huawei’s Full Connection Conference opened and officially released the AI ​​product Atlas900. Hu Houkun, Huawei’s rotating chairman, called it “the fastest AI training cluster in the world.” Altas 900 is composed of thousands of Ascend 910 chips developed by Huawei HiSilicon, and its computing power can reach 256-1024 PFLOPS@FP16. Training ResNet-50 only took 59.8 seconds of cluster size, using 1024 Ascend 910s.

Hu Houkun said in his speech at the above conference that the next 10 years will be a big blue ocean for the computing industry, and the market size will reach 2 trillion US dollars every year. Computing and connection will be the core of the future intelligent era. Therefore, in addition to the connectivity business, Huawei released a new computing industry strategy on site, which mainly covers four points, including breakthroughs in architectural innovation, investment in all-scenario processor families, and a business that insists on doing something and not doing anything. strategy, and spare no effort to build an open ecosystem.

In the future, Huawei will upgrade its Fertile Land Plan and continue to invest US$1.5 billion to expand the number of developers to 5 million.

"National Team" took the lead in establishing China Integrated Circuit Venture Capital Service Alliance

During the 2019 World Manufacturing Conference, the China Integrated Circuit Venture Capital Service Alliance was officially established. The first batch of members of the alliance include three national emerging industry venture capital guidance funds, including BioTech, SDIC Venture Partners, and CICC Qiyuan, as well as more than 40 venture capital institutions and more than 30 integrated circuit companies. The alliance will use the investment resources of venture capital institutions to promote the organic combination of the integrated circuit capital chain, innovation chain, and industrial chain.

MediaTek 5G chip unveiled, released at the end of the year and will be shipped in large quantities in 2020.

announced at the beginning of 2019 that it would launch MediaTek, a major IC design manufacturer integrating 5G baseband SoC, within the year. The product was officially unveiled on the 19th. However, it is expected that the official launch and model announcement will be in December, when MediaTek will hold a global press conference to introduce this heavyweight product to global consumers. Tsai Mingjie pointed out that MediaTek currently invests 20-30% of its annual R&D expenditures in 5G product research and development, and the overall 5G R&D expenditures exceed NT$100 billion.

Bitmain releases 3rd generation AI chip to help Fuzhou build urban brain

On September 17, Fuzhou Municipal Party Committee Deputy Secretary and Mayor You Mengjun announced that Fuzhou City Brain was officially released and started construction. At the same time, Bitmain officially released its 3rd generation AI chip. Generation AI chip BM1684, BM1684 chip will serve as the underlying computing power of Fuzhou City Brain. BM1684 focuses on artificial intelligence inference for cloud and edge applications. It adopts TSMC 12nm process. With a typical power consumption of only 16 watts, the FP32 precision computing power reaches 2.2 TFlops, and the INT8 computing power can reach 17.6Tops. It is a low-power Power consumption, high performance SoC chip.

Yingtang Intelligent Control and China Mobile signed a mobile phone chip cooperation framework agreement

On September 19, Yingtang Intelligent Control issued an announcement stating that the company's holding subsidiary has obtained the supplier qualification of China Mobile. The subsidiary has signed the "Mobile Phone Main Chip Cooperation Framework Agreement" with China Mobile regarding the procurement of MTK main chip products. The announcement shows that this contract is a cooperation framework agreement for long-term cooperation between the two parties. The cooperation subject is mobile phone main chips. The upper limit of the procurement scale of this framework contract is 8 million pieces. It will take effect from the date of signing and will be valid for 2 years.

Allwinner Technology OPEN AI LAB joint press conference was successfully held in Shenzhen

On September 19, Allwinner Technology OPEN AI LAB held a strategic press conference. The two parties reached a strategic cooperation agreement and are committed to providing embedded AI application development tools and platforms to jointly promote The in-depth collaboration of the entire industry chain of chips, hardware, and software enables artificial intelligence wherever there is computing, ultimately solving the problems of machine intelligence and system ecological fragmentation. At the meeting, OPEN AI LAB authorized Quanzhi Technology to install the Tengine acceleration platform on the car-grade chip T7 for free.

TSMC’s 7-nanometer production capacity order cannot be completed and it will add an additional NT$1.3 billion in equipment

According to news on September 19, TSMC, a Taiwan-based semiconductor manufacturer, recently announced that it has ordered NT$5.668 billion (approximately NT$5.668 billion) from companies such as Applied Materials. RMB 1.3 billion) equipment. Since this year, TSMC’s 7nm production capacity has continued to be fully loaded.According to previous reports, TSMC added an additional 7nm production capacity in July to cope with urgent orders from Bitmain. In addition, Apple's A13 chip does not use TSMC's 7nm EUV process, which may also be related to TSMC's production capacity.

Liu Deyin: TSMC’s R&D focus is on 3nm and 2nm development.

TSMC Chairman Liu Deyin said that in addition to 7nm and 5nm, TSMC’s current R&D focus is on the 3nm process, and the current progress is also satisfactory, even 2nm. Nano also continues to be developed. So it’s exciting to see new ideas every week.

The Loongson Zhongke southern headquarters project with a total investment of 3 billion yuan was settled in Nanjing

htmlOn September 18, the 2019 China Nanjing Golden Autumn Economic and Trade Fair major project centralized signing ceremony was held. Six major projects were signed and settled in Nanjing Software Park. The total project The investment reaches 10 billion yuan, covering 5 semiconductor industry-related projects. As the earliest domestic enterprise engaged in the research and development and industrialization of domestic CPUs, Loongson Zhongke plans to build a southern headquarters base. According to reports, the headquarters project plans to invest 3 billion yuan and use about 200 acres of land to build the Loongson Independent Innovation Industrial Park. The Hefei Changxin Integrated Circuit Base Project signed a contract with a total investment of 220 billion. , Northern Huachuang (002371) and others held a signing ceremony for the Hefei Changxin integrated circuit manufacturing base project. The total investment of the project exceeds 220 billion yuan. Once completed, it is expected to generate an output value of more than 200 billion yuan, gather more than 200 leading upstream and downstream enterprises, and attract more than 200,000 talents of all types. It was reported on the 22nd that Hefei also established the China Integrated Circuit Venture Capital Service Alliance.

Zhiguang Electric: Yuexin Semiconductor's 12-inch chip production project has been put into operation

Zhiguang Electric announced on the evening of September 22 that the 12-inch chip production line project (Phase I) built by Yuexin Semiconductor has reached the conditions for production and achieved mass production on September 20. Produce. Yuexin Semiconductor's production includes microprocessors, power management ICs, analog chips, power discrete devices, etc., meeting the needs of analog chips and discrete devices for innovative applications such as the Internet of Things, automotive electronics, artificial intelligence, and 5G. The company indirectly holds equity in Yuexin Semiconductor.

Hangzhou Zhongxin Wafer is mass-producing 8-inch large silicon wafers for trial production of 12-inch

The largest and most technologically mature factory in China, with independent core technology and truly capable of mass-producing semiconductor large silicon wafers - Hangzhou Zhongxin Wafer Semiconductor Co., Ltd.'s large silicon wafer project was completed and put into production in Qiantang New District, Hangzhou on the 21st, achieving formal mass production of 8-inch large silicon wafers. At the same time, the 12-inch large silicon wafer production line entered the debugging and trial production stage. This project is expected to achieve a monthly production of 350,000 8-inch semiconductor wafers next year.

Huahong Wuxi project (phase one) 12-inch production line was successfully completed and put into production

On the morning of September 17, the Huahong Wuxi project made phased progress. The first phase of the 12-inch production line was successfully completed and put into production at the Wuxi project site. The first batch of 12-inch silicon wafers has entered the process machine and the manufacturing of 55-nanometer chip products has begun. This marks that the project will officially enter the production and operation period from the engineering construction period. The project's monthly production capacity is planned to be 40,000 pieces, and the process technology platform covers emerging application fields such as mobile communications, the Internet of Things, smart homes, artificial intelligence, and new energy vehicles. Chen Guohua, general manager of the gallium arsenide factory Wenmao, said yesterday that the current production capacity is fully loaded and it is expected to expand the machine capacity in the fourth quarter. Next year, the production capacity will be expanded by 5,000 pieces, with a production expansion rate of about 14%. Chen Guohua said that this year is the first year of 5G. It is expected that the number of 5G mobile phones will reach 200 million next year, and further expansion is expected in the next year, which will be beneficial to compound semiconductors; in addition, compound semiconductors can also be used in autonomous driving, augmented reality and virtual reality, etc. , will be inseparable from life.

Keysight Technologies joins hands with ASE to accelerate the development of packaged antenna technology

Keysight Technology and ASE Semiconductor Manufacturing Company announced a cooperation last week to work together to improve the design and test verification efficiency of developing AiP (antenna in package) technology and accelerate the pace of innovation.Keysight Technologies is a leading technology company helping enterprise, service provider and government customers accelerate innovation and create a secure and connected world.

Longsys obtained SD-3C’s 10-year patent authorization and jointly carried out rights protection work

On September 20, Longsys Electronics held a press conference at Zhongshan and announced that it had signed a 10-year SD memory card license agreement with SD-3C. Under the license agreement, SD-3C grants Longsys the right to develop, manufacture and sell SD cards and microSD memory cards globally. In addition, the two companies also announced that they will cooperate to carry out actions to protect SD-3C’s rights in the Chinese market. Longsys is one of the largest flash memory equipment manufacturers in China.

Hon Hai accelerates its layout in the semiconductor field and provides industry vertical integration solutions

Chen Weiming, deputy general manager of Hon Hai's S sub-semiconductor sub-group, said that semiconductors and artificial intelligence will become important weapons in the future smart world. He said that the group wants to become a solution provider from IC to software, and can also vertically integrate the upstream and downstream industries. Hon Hai Group will establish more IC design companies. In the semiconductor field, Hon Hai has laid out equipment, packaging, wafer fabs, IC design, system integration, channels and other fields.

New progress in the asset restructuring of Wingtech Technology Holding 100% equity of Zhongwen Jintai

On September 18, Wingtech Technology announced that according to the resolution of the company’s second extraordinary general meeting of shareholders in 2019 and approved by the China Securities Regulatory Commission, the company will pass the issuance The indirect control of the target company Nexperia Holding B.V. ("Nexperia Group") is achieved through shares and cash payment. Hefei Zhongwen Jintai Semiconductor Investment Co., Ltd. is one of the target companies of this transaction. As of the announcement date, Wingtech Technology holds 100% of the equity of Hefei Zhongwen Jintai.

Tongfu Microelectronics shareholder Jianghai Fund will reduce its holdings to no more than 1% of the company's shares

On September 16, Tongfu Microelectronics, a company listed on the Shenzhen Stock Exchange, announced that it holds 57,685,229 shares of Tongfu Microelectronics (accounting for 5.00% of the company's total share capital) %) shareholder Nantong Merchants Jianghai Industrial Development Fund Partnership (Limited Partnership) plans to reduce its shareholding of the company's shares by centralized bidding transactions or bulk transactions within 90 days after 15 trading days from the date of announcement of this shareholding reduction plan. 11,537,045 shares (i.e. no more than 1% of the total number of shares of the company).

South Korea officially sues Japan to the WTO or kicks it out of the "white list"

On September 17, the World Trade Organization (WTO) announced that as Japan strengthens its export management of Korean semiconductor materials, South Korea has filed a lawsuit against Japan. It also requires the WTO to negotiate with Japan on the product and technology export restrictions Japan has imposed on South Korea. At the same time, the South Korean government said that in response to Japan's removal of South Korea from the export "white list", they will also remove Japan from the "white list" as soon as next week.

Global semiconductors have entered the "freezing point", but new changes may occur next year.

Market research organization ICInsights recently released a report, which calculated the revenue of global semiconductor companies in the first half of the year. The report shows that in the first half of 2019, the total sales of the world's top 15 semiconductor companies fell by 18% year-on-year, while the total sales of the global semiconductor industry fell by 14% year-on-year. However, the International Semiconductor Equipment and Materials Organization predicts that the total investment in new wafer fab construction starting in 2020 will reach US$50 billion, an increase of approximately US$12 billion from 2019.

Semiconductor M&A rebounds, generating US$28 billion in mergers and acquisitions in the first eight months

According to an IC Insights report, the value of semiconductor acquisition agreements in the first eight months of 2019 exceeded the total of 2018 (US$25.9 billion), approaching 2017. From January to the end of August, a total of about 20 merger and acquisition agreements were announced globally, with a total value of US$28 billion, including the acquisition of chip companies, business units, product lines, intellectual property and wafer fabs.

Changxin Storage Technology Co., Ltd. Zhu Yiming became the second Chinese representative on the GSA board.

The Global Semiconductor Alliance (GSA) announced on September 17 that Zhu Yiming, chairman and CEO of Changxin Storage Technology Co., Ltd. , was appointed to the alliance's board of directors. member.GSA represents 70% of the US$450 billion semiconductor industry, and its board of directors includes senior leaders from global semiconductor giants such as Intel, Samsung, and AMD. Previously, SMIC's co-CEO Zhao Haijun was the only member of the board of directors representing mainland China's semiconductor companies.

Samsung’s semiconductor business has bottomed out and will resume chip inventories in the second half of the year

According to Yonhap News Agency, according to a report by market research firm IHS Markit, Samsung Electronics’ Q3 share of the global DRAM market is expected to reach 47%. In the second quarter, they were 41% and 43% respectively. "Samsung's semiconductor business is expected to bottom out in the second quarter of this year, and Samsung's operating profit will recover in the third and fourth quarters as chip inventories decrease," said Eo Gyu-jin, an analyst at DB Financial Investment.

French Finance Minister and STMicroelectronics CEO jointly inspected the new laboratory

Last week, French Finance Minister Agnès Runacher and STMicroelectronics CEO Jean Marchilli jointly visited Singapore to inspect STMicroelectronics’ New laboratory in Singapore. STMicroelectronics officially opened a new Fab in Singapore on September 17, aiming to enhance its strength in the fields of automotive electrification and digitalization. The laboratory was acquired from Micron in 2017 and was formerly a Numonyx factory.

Broadcom’s chip business has bottomed out, but it’s unclear when it will truly recover.

According to foreign media Electronics Designs, Broadcom recently stated that its core chip business has begun to bottom out, but it is not sure when it will truly recover from the economic slowdown. since recovery. "We believe that demand in the semiconductor solutions sector has bottomed out, but due to the current uncertain environment, demand will continue to remain at this level." Broadcom CEO Hawke Tann pointed out in a statement.

Infineon Technologies AG is listed among the world's most sustainable companies

Infineon Technologies AG is once again listed on the Dow Jones Sustainability Global Index in the list released by RobecoSAM, a professional organization focusing on sustainable development investments. , among the most sustainable companies in the world. Infineon stood out from 47 participating companies in the semiconductor industry and became one of the six companies listed on the global index.

Sony does not agree to split the semiconductor business: long-term retention is the best strategy

According to foreign media reports, Sony said last Tuesday that the company’s board of directors and management did not agree with its shareholder activist hedge fund Third Point’s proposal to separate the semiconductor business from the entertainment business. Proposed spin-off and separate listing. The board of directors and management agree that retaining the semiconductor division is the best strategy in the long run. In addition, by retaining the semiconductor department, Sony can also combine photosensitive components with AI to develop related chip products such as self-driving cars and games, thereby enhancing the competitiveness of the semiconductor department.

ams lists potential buyers for Osram digital business

Recently, sensor supplier ams CEO Alexander Everke said that it has made a list of potential buyers for Osram's digital business, if it can With the successful acquisition of Osram, this business will be smoothly divested. ams’ vision is to become a more influential automotive lighting supplier and provide more heavyweight sensor solutions and photonics technologies. This is why ams intends to acquire Osram and divest its non-automotive business body.

Xinding plans to acquire 67.82% of the shares of Ziguang Technology at a price of HK$990 million

A few days ago, Ziguang Technology (Holdings) Co., Ltd. issued an announcement stating that Ziguang Technology Strategic Investment Co., Ltd. has entered into an agreement with Xinding Co., Ltd. and Beijing Ziguang Capital Management Co., Ltd. Share Purchase Agreement. According to the agreement, Xinding will acquire 67.82% of the equity of Ziguang Technology for HK$990 million. According to the situation in recent years, mobile chips and 5G have become one of the focuses of Ziguang Technology’s business.

Qualcomm accelerates 5G layout with US$3.1 billion and adds radio frequency enterprise RF360

On September 17, Qualcomm announced that it would spend US$3.1 billion to acquire Japan’s TDK’s remaining equity in the radio frequency front-end technology joint venture RF360 Holdings Singapore Pte. Qualcomm said that this was part of its 5G strategic layout. Another important milestone. Qualcomm disclosed that as of August this year, the valuation of TDK's remaining shares in RF360 was US$1.15 billion. The total acquisition price was approximately US$3.1 billion, including initial investment, payments to TDK based on the joint venture's sales, and development commitments. .

Powerchip Technology's profit fell 36.4% in the first half of the year, and it is still pursuing a listing next year.

Powerchip Technology said on September 18 that this year, affected by factors such as US-China trade friction and declining memory prices, consolidated revenue in the first half of the year was NT$16.757 billion. , down 36.4% year-on-year. However, in response to the relisting plan that the market is paying attention to, Powerchip still stated that it will continue to maintain its original goal and expects to return to the market in 2021. However, DRAM foundry accounts for 50% of its total production capacity, and customers are still affected by the business cycle. Therefore, how to continue to make profits will be the primary goal before going public.

Nanjing SEG Microelectronics Technology Co., Ltd. terminated its listing in the first half of the year and its profits fell sharply by 240.11%

On September 12, Nanjing SEG Microelectronics Technology Co., Ltd. issued an announcement stating that in order to coordinate with the company’s business development strategy adjustment, it plans long-term development goals and improves the company’s operating efficiency. In order to reduce the company's listing maintenance costs, after careful consideration, the company plans to apply to the National Equities Exchange and Quotations to terminate the listing of the company's shares. In the first half of 2019, SEG Micro's main business income was 16653475.01 yuan, a year-on-year decrease of 40.02%; the net profit attributable to shareholders of the listed company was -3523014.51 yuan, a year-on-year decrease of 240.11%.

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