House2 patch processing sometimes occurs during , and tin beads are one of them. For SMT factory , the tin beads that appear during the processing process must be solved. An excellent electronics processing factory must do its best to eliminate all processing defects. To solve the problem, we must first know the reason for the problem. Now patch processing factory will analyze the reason for the occurrence of tin beads. Jiangxi Inteli Electronic Technology Co., Ltd. was established in May 2016. The company is headquartered in Linchuan High-tech Industrial Park, Fuzhou City, Jiangxi Province. The company independently develops DC and AC charging piles and energy storage products, and also provides one-stop EMS services for the new energy and industrial industries. It has a factory area of 30,000 square meters, 24 SMT production lines, 8 plug-in lines, 4 wave soldering lines, 8 assembly lines, and 4 packaging lines, with a total investment of 1 billion yuan, equipped with an advanced and complete digital management system, and is committed to building excellent ODMs in the charging and energy storage industries, as well as EMS Industry 4.0 smart factory.
Solder beading is a term used to distinguish a -solder ball that is unique to flake elements. Tin beads occur when the solder paste collapses or when the pad is pressed out during processing. During reflow, the solder paste is isolated from the main precipitation, gathers with excess solder paste from other pads, or emerges from the sides of the component body to form large tin beads, or stays under the component. Eliminate tin beads. Try not to remove them directly. Pay attention to them during the production process to avoid them. Below, Jason Tai will explain to you what situations will cause tin beads to be produced on the patch based on past experience:
1. steel net
1. Opening the steel net directly according to the size of the pad will also lead to tin beads during the patch processing.
2. If the thickness of the steel mesh is too thick, it may also cause the solder paste to collapse, which will also produce tin beads.
3. If the pressure during patch machine is too high during mount, the solder paste will easily be squeezed onto the solder resist layer under the component. When reflow soldering , the solder paste melts and runs around the component to form tin beads.
2. Solder paste
1. Other precautions If the solder paste has not been re-warmed, it will splash during the preheating stage, resulting in tin beads.
2. The smaller the particle size of the metal powder in the solder paste, the larger the overall surface area of the solder paste, resulting in higher oxidation of the finer powder, and thus the phenomenon of solder beads is intensified.
3. Metal Powder Oxidation The higher the oxidation of the metal powder in the solder paste, the greater the resistance to bonding of the metal powder during soldering, and the solder paste and the SMT patch element will not be easily wet, resulting in a reduction in solderability.
4. Too much flux and the active flux amount will cause local collapse of the solder paste and then produce tin beads. When the flux is not active enough, it will also lead to the occurrence of tin beads during processing.
5. Metal content solder paste used in actual processing is generally of 88%~92%, and the volume ratio is about 50%. Increasing the metal content can make the arrangement of metal powders closer, so it is easier to combine when melted.
The above is about the reason why tin beads are produced on the patch during patch processing. You can compare according to your actual situation and see if you have these reasons. If so, try to change it and see if it will be solved. If it still doesn’t solve the problem, please contact us and discuss with each other. Thank you! 
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