The Gemini Jiangsu Changdian and Huatian Technology for packaging and testing in mainland China. So when it comes to Jiangsu Changdian Technology , we must talk about another packaging giant in northwest China: Huatian Technology.
Jiangsu Changdian acquired Xingke Jinpeng of Singapore , so we will also learn about Huatian Technology from a acquisition case.
Huatian Technology
On September 13, 2018, Tianshuihuatian Technology issued an announcement, announcing that it would acquire 75.72% of the outstanding shares of Malaysian semiconductor packaging and testing company Unisem for no more than 1.817 billion ringgit (approximately RMB 2.992 billion). As of January 9, 2019, the offer shares officially entered the delivery stage.
Huatian Technology completed the acquisition of Unisem.
encapsulation and testing equipment. Netmap
Unisem is a large-scale chip encapsulation and testing provider in Malaysia . Its main customers include Infineon, ST, Broadcom, Qorvo, Skyworks and other international IC design manufacturers.
Unisem's revenue comes from the automotive industry, 28% comes from the communications industry, and 30% comes from the consumer sector.
Huatian Technology's acquisition of Unisem will help expand Huatian's market business, complete the business territory, and enhance Huatian's influence in international business.
Unisem
Huatian Technology was established in November 2003. Compared with the development history of Jiangsu Changdian, Huatian can be said to be established at the forefront of history and has developed rapidly. It has entered the forefront of the industry less than 20 years since its establishment.
2003 Established Tianshui Huatian Technology Co., Ltd.
2004 Huatian Technology Co., Ltd. is listed on the Shenzhen Stock Exchange
2008 Established Huatian Technology (Xi'an) Co., Ltd.
2010 Established Huatian Technology (Kunshan) Co., Ltd.
2015 Acquisition of FCI, adding new factories in Phoenix City and Shanghai in the United States
2018 Acquisition of Unisem, and plans to build an advanced packaging industry base in Nanjing
2019 Huatian Technology Headquarters moved to Xi'an
Network Picture
Now let’s learn about its business development through the first half of the year report released by Huatian in August 2022.
Huatian's main business is integrated circuit packaging and testing. The product types of packaging:
DIP/SDIP, SOT, SOP, SSOP, TSSOP/ETSSOP, QFP/LQFP/TQFP, DFN, QFN, BGA, LGA, FC, MCM (MCP), SiP, WLP, TSV, Bumping, MEMS, Fan-out and other technologies. For details, please refer to the official website of Huatian Technology.
History of packaging technology changes
Huatian's revenue in the first half of 2022 was 6.2 billion yuan, an increase of 10.7% over last year; net profit was 510 million yuan, a decrease of 16% over last year.
data reaction is consistent with the market situation.
From 2020 to 2021, chip output is tight. On the one hand, the supply is less than demand, and the market demand has increased significantly. Every supplier is grabbing Foundry's tea, but Foundry's production capacity is impossible to be newly added at once. Therefore, IC design manufacturers will adjust the capacity distribution of various chips based on market price and supply and demand to maximize profits. Another reason for
is packaging testing. Each Foundry maximizes its production capacity, and the products will definitely not be less than before. This is just the output of wafer , and it needs to be tested after wafer output. Testing includes CP testing, FT testing and final packaging testing, and the production capacity of tests and packaging is also basically fixed. It turned out that Foundry could also assist IC design manufacturers in the wafer stage to conduct part of the test, but now Foundry is unexpected, so it is put all in the packaging factory for testing. Of course, in order to meet the needs, packaging plants can increase equipment investment and test production capacity. But I still can't get busy. It turned out that the half-month cycle might have to be extended to three months, and the demand forecast for packaging and testing plants sales has also been extended from three months to 12 months. However, demand forecasts with such a long cycle are not accurate at all. IC design manufacturers are not even accurate in their monthly output plans, and a year is just a big cake. Therefore, the price increase of packaging and testing factories should be the time when the packaging and testing factories have the highest profit margin.
net diagram
Huatian also clearly pointed out the fact that market demand in the semiconductor industry has slowed down. But we also hope for the efforts of automotive electronics.
This situation will be alleviated after a difficult time of severe stock outages in the automotive electronics factory. From the Foundry factory, some mature processes, namely: 45nm, 65nm, 90nm, etc., were transferred to automotive electronics in a planned manner at the beginning of this year to alleviate the stressful demand. Due to the pressure of goods from dealership agents on the sales side, it takes a certain amount of time to consume inventory, and the economy is weak, many large manufacturers have begun to cancel orders, so the market has changed from a full out of stock to a shortage of stock, and the outage time will no longer be returned to a year or even longer.
Let’s take a look at Huatian’s market situation:
Huatian’s main business still comes from the packaging and testing of integrated circuits, but from the perspective of the market area, the domestic and international markets are almost the same.
Let’s go back to the incident of Huatian’s acquisition of Unisem. This acquisition has completed the international layout of Huatian Technology, with more balanced business and more competitive in the future. The development of the packaging and testing business has also witnessed the development of China's semiconductor industry from another aspect. In the future, scale and patenting will definitely be a trend for this industry to maintain its advantages and competitiveness. I hope that China's semiconductor will continue to cheer and the packaging and testing industry will continue to cheer.
