friends who are concerned about the chip industry know that Dr. Jiang Shangyi previously served as the R&D director of TSMC . TSMC can rise to become the world's largest chip foundry, and Jiang Shangyi played a certain core role.
From 16 to 19, Dr. Jiang Shangyi worked at SMIC . The following year he served as the CEO of Wuhan Hongxin. Since December 20, has served as two important positions since he returned to join SMIC. One of the tasks is to propose to develop advanced chip packaging technology, and the other is to communicate and communicate related matters concerning the introduction of advanced equipment.
There is no doubt that for now, the first job is more important.
According to Jiang Shangyi’s previous statement at the Core Creation Annual Conference, chip demand is diversified, and SMIC will explore and develop advanced processes and packaging technologies. Especially in the post-Moore era, advanced packaging technology can be used to improve chip performance.
It is worth mentioning that SMIC’s financial expenditure this year is 28 billion, most of which is used to expand the production capacity of mature process chips, mainly because the 40nm and 28nm processes used in the automotive field have a huge market and demand exceeds supply Under the circumstances, production capacity must be expanded.
Of course, SMIC is able to expand its 28nm production line twice. In addition to the increased revenue support, it is mainly due to SMIC’s 28nm mature process that is the mainstream technology. Therefore, the results have also confirmed that for SMIC, the expansion of the 28nm chip production line is doing the right thing.
Moreover, SMIC has not been "affected" by TSMC. I want to mention the influence of TSMC here because the current chairman of the front-end semiconductor company Liu Deyin said that 28nm supply exceeds demand. As a result, not long afterwards, TSMC reported that it would also expand its 28nm production line.Therefore, it is obvious for TSMC to "follow the trend" SMIC.
This is one of them. The second is that after Dr. Jiang Shangyi from SMIC proposed the development of packaging technology, TSMC also expressed its focus on the development of advanced packaging technology. For example, TSMC plans to jointly develop packaging technology with Sony and build production lines for packaging and testing plants. From this point of view, TSMC also somewhat "follows the trend" of SMIC.
Of course, both are companies specializing in chip manufacturing, and they have to face a realistic problem together, which is the bottleneck of the Moore limit. Therefore, it is necessary to study advanced packaging technology to improve the performance of the chip.
Despite the physical limits of Moore's Law aside, Jiang Shangyi previously served as the COO of TSMC and led the team to achieve leading results. Now he is contributing to SMIC. For TSMC, follow It is natural for Dr. Jiang’s technical philosophy to keep pace. After all, both TSMC and SMIC’s technological progress have Jiang Shangyi’s direct participation.
In addition, SMIC's emphasis on talents is obvious to all. Dr. Jiang Shangyi and other talents can quietly realize their ideals.
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