Dimensity 1200 adopts TSMC's 6nm process technology, and the CPU adopts a "1+3+4" three-cluster architecture, including 1 A78 large core with a main frequency of 3.0GHz, 3 A78 medium cores with a main frequency of 2.6GHz, and 4 2.0GHz A55 small cores. The official said that the CPU performance has been improved by 22% compared with the previous generation and 25% energy efficiency has been improved; the GPU uses Mali-G77 MC9, and the graphics performance has been improved by 13%.
Dimensity 1200 also integrates APU 3.0 and 5G baseband, with a peak downlink rate of 4.7Gbps and an uplink of 2.5Gbps, supports dual SA 5G Internet access, and provides scenario application modes such as 5G high-speed rail mode and 5G elevator mode. In terms of peripheral characteristics, it supports LPDDR4x memory, UFS 3.1 flash memory, WiFi 6, Bluetooth 5.2, supports up to FHD+ 168Hz or 2K 90Hz screens, and the ISP supports up to 200 million pixels, with single-frame progressive 4K HDR video technology and supports AV1 video encoding format.
Dimensity 1100 also adopts a 6nm process technology. Compared with Dimensity 1200, it cuts the 3.0GHz large core and weakens some peripheral characteristics. The CPU integrates 4 2.6GHz A78 large cores and 4 2.0GHz A55 small cores, uses Mali-G77 MC9 GPU (the frequency is reduced compared to Dimensity 1200), integrates APU 3.0 and 5G baseband, and the baseband performance is the same as Dimensity 1200. In terms of peripheral features of
, Dimensity 1100 supports LPDDR4x memory, UFS 3.1 flash memory, WiFi 6, Bluetooth 5.2, supports up to FHD+ 144Hz or 2K 90Hz screens, and the ISP supports up to 108 million pixels. The specific specification differences between
can be seen in the figure below:
Next, terminal products equipped with the Dimensity 1200/1100 platform will be launched one after another. Currently, Redmi has announced that it will launch the Dimensity 1200 platform for the first time.
Overall, the improvement of the two products released today over Dimensity 1000 is mainly in terms of CPU performance and energy efficiency. At the same time, the chip support characteristics have also been upgraded to certain upgrades - such as supporting UFS 3.1 flash memory. Since the GPU is the same as the previous generation core specifications, the improvement brought by the increase in frequency alone is relatively limited, and the overall positioning will be more inferior to the flagship.