is based on the 3nm Gate-All-AroundT (GAA) process and is expected to be a game changer in the semiconductor industry. Samsung Electronics plans to catch up with TSMC, the world's largest foundry company, by establishing a 3-nanometer GAA process in the next three years.
GAA is a next-generation process technology that improves the structure of semiconductor transistors so that the gate contacts all four sides of the transistor instead of the three sides in current FinFET processes. The GAA structure allows for more precise control of current flow than FinFET processes. According to data from TrendForce, TSMC accounted for 52.1% of the global foundry market in the fourth quarter of 2021, far exceeding Samsung Electronics' 18.3%.
Samsung Electronics is betting on applying GAA technology to its 3nm process to catch up with TSMC. According to reports, the South Korean semiconductor giant placed wafer in the 3-nanometer GAA process for trial mass production in early June, becoming the first company in the world to use GAA technology. It is looking to immediately close the gap with TSMC through technological leaps. Compared to the 5-nanometer process, the 3-nanometer process improves semiconductor performance and cell efficiency by 15% and 30%, respectively, while reducing chip area by 35%.
After applying GAA technology to its 3-nanometer process in the first half of this year, Samsung plans to introduce it to the second-generation 3-nanometer chip in 2023 and mass-produce GAA-based 2-nanometer chips in 2025. TSMC’s strategy is to enter the 3nm semiconductor market in the second half of this year, using stable FinFET technology, while Samsung Electronics is betting on GAA technology.
Experts say Samsung can be a game-changer in the foundry market if it ensures stable yields in its GAA-based 3nm process. TSMC is expected to introduce the GAA process starting with 2nm chips and release the first product around 2026. For Samsung Electronics, the next three years will be a critical period.
Recently, Samsung announced that it will invest a total of 450 trillion won in key industries such as semiconductors over the next five years. However, there are many obstacles in advancing to 3nm. Like Samsung, TSMC is having trouble improving yields on its 3nm process.
Samsung Electronics is also facing a similar situation. The wafers have been put into pilot mass production on the 3nm process, but the company has been delaying formal mass production announcements due to low yield issues. "Unless Samsung Electronics secures enough customers for its 7-nanometer or more advanced process, it may heighten investor anxiety over Samsung Electronics' future performance," said Roh Keun-chang, head of research at Hyundai Motor Securities.
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