Today's hot topics
1. Samsung launched the industry's first 24Gbps GDDR6 DRAM, using 1z nm process
2. Hon Hai announcement confirmed that through Industry Fullian for 5.38 billion investment in Unigroup
3. 1175 billion US dollars! Global semiconductor manufacturing equipment revenue this year is expected to hit a new high
4. Netherlands confirmed discussions with the United States to prevent ASML from selling DUV equipment to China
5. IBM cooperates with Tokyo Electronics to develop new 3D chip stacking technology for 12-inch wafer
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Samsung launches the industry's first 24Gbps GDDR6 DRAM, using 1z nm process
Samsung Electronics 14 announced that it has begun to provide the industry's first 16Gb GDDR6 DRAM with a processing speed of 24Gbps. The new memory is based on Samsung's third-generation 10nm (1z) process and uses extreme ultraviolet light (EUV) technology, aiming to significantly improve the graphics performance of next-generation graphics cards, laptops and games, as well as applications and high-performance computing systems based on AI .
Samsung 24GBbps GDDR6 uses an innovative circuit design and highly advanced insulation (HKMG) to minimize current leakage, with a speed increase of 30% compared to previous 18Gbps products. When integrated into high-end graphics cards, GDDR6 DRAM can transfer up to 1.1TB of data in one second, or about 275 full HD movies.
Samsung GDDR6 DRAM is fully compliant with JEDEC specifications and will be compatible with all GPU designs. Samsung's new GDDR6 lineup will also feature low-power options that help extend the battery life of the laptop. Using Dynamic Voltage Switching (DVS) technology that can adjust the operating voltage according to performance requirements, Samsung will offer 20Gbps and 16Gpbs versions, with an energy efficiency improvement of about 20% at 1.1V compared to the 1.35V GDDR6 industry standard.
With customer verification starting this month, Samsung plans to commercialize 24Gbps GDDR6 DRAM to cooperate with the launch of the GPU platform, thereby accelerating graphics innovation in the entire high-speed computing market.
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Hon Hai announced that through Industrial FULL has invested 5.38 billion in Unigroup
According to Taiwan media "Financial News", Hon Hai announced on the 14th that it confirmed that it was indirectly invested in Unigroup. Its subsidiary Industrial FULL has converted to invest in Shengyue Guangzhou for 5.38 billion in Unigroup, and then converted to invest in Zhiguangxin. Zhiguangxin obtained 100% of Unigroup equity through judicial reorganization. The investment purpose is to invest in financial investment in . (It was previously reported that Industrial FULL invested 9.8 billion yuan in to invest )
Hon Hai announced that this time, through Industrial FULL , which holds 499.99% of html, Xingwei Fund, which holds 48.91% of stake in Shengyue Guangzhou for 5.38 billion yuan, and then invests in Zhiguangxin, which holds 20.04% of stake, and Zhiguangxin acquired 100% of the equity of Unigroup through judicial reorganization.
Hon Hai pointed out that this transaction was made by Zhiguangxin's decision to invest in Unigroup. The Xingwei Fund Investment Decision-making Committee (delegated by the fund manager) made an investment decision based on the Fund decision-making procedure, and decided that Xingwei Fund would invest in Shengyue Guangzhou, and Shengyue Guangzhou would invest in Zhiguangxin again, thereby ultimately investing in Unigroup.
Hon Hai emphasized that the amount of investment in Unigroup this time was 5.38 billion, and the capital was actually collected was 670 million. Unigroup is a leading digital technology enterprise in China. Its business projects include IC design, router, switch , server, etc. The main investment purpose is financial investment.
For Hon Hai’s indirect investment in Unigroup, foreign investors issued a latest report stating that because Unigroup has a strong and broad influence in the semiconductor field from IC design, packaging and testing, it is in line with Hon Hai’s “3+3” strategy in the semiconductor field, and believes that in the long run, it will help Hon Hai’s operation and development.
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117.5 billion US dollars! Global semiconductor manufacturing equipment revenue this year is expected to hit a new high
International Semiconductor Industry Association (SEMI) expects that global semiconductor manufacturing equipment revenue this year is expected to hit a new high, reaching US$117.5 billion, a growth of 14.7%, and will further reach US$120.8 billion in 2023.
SEMI pointed out that includes wafer process, wafer factory facilities and optical mask equipment and other wafer equipment revenue this year is expected to reach US$101 billion , which will hit a new high with a growth of 15.4%, and will grow by another 3.2% in 2023 to US$104.3 billion.
SEMI said that with strong investment in digital infrastructure, the semiconductor industry has actively increased and upgraded production capacity, and wafer factory equipment's revenue this year will exceed the $100 billion mark for the first time.
Driven by the demand for advanced and mature processes, SEMI expects that 's equipment revenue in wafer foundry and logic fields will reach US$55.2 billion this year, with a growth of 20.6%, and will grow another 7.9% in 2023 to reach US$59.5 billion.
In terms of storage, SEMI expects that this year's dynamic random access (DRAM) device revenue is expected to grow by 8%, reaching US$17.1 billion , which may decline by 7.7% in 2023; flash memory (NANDFlash) device revenue will reach US$21.1 billion this year, which will grow by 6.8% , which may decline by 2.4% in 2023.
SEMI expects that packaging equipment revenue this year is expected to reach US$7.8 billion, growing 8.2% , and will drop slightly by 0.5% to US$7.7 billion in 2023. test equipment revenue will grow by 12.1% this year, reaching US$8.8 billion . In 2023, driven by the demand for high-efficiency computing applications, it is expected to increase by another 0.4%.
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The Netherlands confirmed to discuss with the United States to prevent ASML from selling DUV equipment to China
According to Bloomberg last week, US officials are lobbying ASML to ban the sale of deep ultraviolet light (DUV) lithography machine for mature processes, curbing the rise of China's semiconductor industry. Although these devices are not the most advanced generation, they are the most commonly used devices in manufacturing cars, phones, computers and even robotic chips.
The Dutch government faces pressure from US officials, but has not agreed to any additional restrictions yet, because China is the Netherlands' third largest trading partner after Germany and Belgium.
On the other hand, ASML opposes banning the sale of DUV equipment to Chinese customers because it is a mature technology. According to information revealed by the company and Bloomberg data, Chinese facilities operated by domestic or foreign companies account for 14.7% of ASML's total revenue in 2021.
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IBM cooperated with Tokyo Electronics to develop new 3D chip stacking technology for 12-inch wafers
According to Taiwan's "Science and Technology News", IBM and Japanese semiconductor equipment manufacturer Tokyo Electronics recently announced that it has made new technological breakthroughs in 3D chip stacking and has successfully used a new technology to use 3D chip stacking technology on 12-inch wafers. Since the chip stack is currently only used in the production of advanced semiconductor products, such as high bandwidth storage (HBM). However, after IBM and Tokyo Electronics proposed new technologies, there is an opportunity to expand the application of 3D chip stacking technology.
report pointed out that 3D chip stacking technology is currently regarded as one of the powerful tools to continue Moore's Law (Moore's Law), which has led many semiconductor companies to work hard, hoping to convert the number of transistors "per unit area" to "number of transistors per unit volume". Compared with the chip with a general planar structure, 3D chip stacking allows for multi-layer stacking, and silicon perforated packaging (TSV) is the key to 3D chip stacking technology.
The newly developed technology of IBM and Tokyo Electronics is essentially a new way to connect silicon chips together. Conventional chip stacking requires silicon perforations between stacks, which can cause power to flow upward into the stack and allow the two layers to perform the work in series.However, this requires cutting the back of the stack to expose the TSV space to provide another stack to connect through the TSV. However, the thickness in the stack is very thin, usually only less than 100 microns. And because of their fragility, they need a carrier chip to support it.
So, usually these carrier chips are made of glass. Borrow the bonding of the carrier wafer to the wafer to ensure it is not damaged during the production process. After completion of production, the carrier is removed using ultraviolet laser. In some cases, a carrier chip can also be used, but separating it from layer requires physical mechanical force to aid, which can pose a risk to wafer integrity. Therefore, in the newly developed technology of IBM and Tokyo Electronics, infrared laser will be used to separate layers and further peel off two silicon-perforated wafers, which will effectively reduce the risk of destroying wafer integrity.
