Report summary:
- Consumer electronics are developing towards a trend of lightweight and diversification to increase the demand for heat dissipation High-performance electronic products are getting thinner and thinner, the volume of electronic components is constantly shrinking, but their power density is rapidly increasing. The components that generate heat by mobile phones are mainly CPUs, batteries, motherboards, etc., and the heat dissipation issue has become an important issue. G Mobile RF front-end upgrades will increase the number of antennas, and increase the transmission speed and increase the heat dissipation demand; when the smart machine performs high-efficiency power consumption functions and applications, SoC will emit a lot of heat, increasing the heat dissipation demand.
- mobile phone heat dissipation solutions are emerging, and heat pipe/temperature equalization plate heat dissipation technology is prominent Traditional thermal conductivity metal materials cannot meet the requirements of high thermal conductivity efficiency. Currently, mobile phone heat dissipation solutions are emerging on the market. These include graphite sheets, graphene, temperature equalization plates, heat pipes, etc. The heat pipe/temperature equalization plate heat dissipation solution thermal conductivity is higher than other solutions, and the thermal conductivity efficiency advantages are outstanding. At the same time, the heat pipe/temperature equalization plate has a long service life, and the temperature equalization effect is better than other heat dissipation solutions. 5G mobile phones such as Huawei, , Xiaomi, and have begun to adopt heat pipe/temperature equalization board heat dissipation solutions. It is estimated that 5G mobile phones will bring 3.1 billion yuan in cooling space in 2022. The development of wireless charging and OLED will also increase the demand for cooling.
- Heat pipe/temperature equalization plate process requirements are high, Taiwanese manufacturers have made early layout, and domestic manufacturers catch up quickly liquid absorbent core structure has a great impact on the working fluid circulation and phase transformation heat inside the temperature equalization plate. Currently, most companies use metal powder sintered liquid absorbent core structure. The traditional temperature equalization board brazing technology has low yield. At present, the diffusion welding process has attracted widespread attention. Many Taiwanese companies such as Shuanghong Technology, Jiance Precision, and Chaozhong Technology have already laid out and mastered the core technologies of heat pipe/temperature equalization boards. Domestic companies such as Sinosteel Technology and Carbon Yuan Technology are also actively deploying heat pipe/temperature equalization board heat dissipation solutions.
- Domestic companies are actively making arrangements and continue to enjoy the high growth of the industry Zhongshi Technology acquires Kaiweidi and actively deploys heat pipe/temperature plate business; Carbon Yuan Technology establishes Carbon Yuan thermal conductivity to successfully introduce temperature plate/temperature plate business; Lingyi Intelligent Manufacturing issuance, increasing the layout of heat dissipation modules; Jingyan Technology sets up a cooling business department at its Changzhou headquarters; Feirongda subsidiary focuses on heat dissipation technology. Taiwan-based companies such as Shuanghong Technology, Jiance Precision, Chaozhong Technology, and Lizhi Technology all have new cooling methods such as temperature equalization boards.
Investment advice
- Recommended attention to Zhongshi Technology, Carbon Yuan Technology, Lingyi Intelligent Manufacturing, Jingyan Technology, and Feirongda.
risk warning
- industry market competition risks, industry competition intensifies risks, technology updates and product development risks.
(Minsheng Electronics: Wang Fang/Chen Haijin/Yang Xu/Hu Duwei)
