Financial World Website News Jingfang Technology announced on the evening of December 13 that recently, the company received RMB 177,642,000.00 for the national funding allocated by national major science and technology project —02 special project national funding allocated RMB 177,642,000.00. The fund is the post-acceptance subsidy fund for the "12-inch silicon through-hole process domestic integrated circuit manufacturing key equipment and materials mass production application project" project (Project number: 2013ZX02107) independently undertaken by the company. The implementation period of the project was from 2013 to 2015, with a total budget investment of RMB 670 million, of which the central government's budget was RMB 260 million. The central government's financial aid was pre-project post-project subsidies (pre-allocated start-up fee). The company received the pre-allocated start-up fee in 2013.
After three years of smooth implementation, the company successfully broke through the bottleneck of advanced 12-inch 3DTSV packaging technology, built the world's first 12-inch 3DTSV wafer-level packaging mass production line, and achieved large-scale mass production for the first time. It has become the main service provider of the global 12-inch 3DTSV packaging mass production business and the exclusive service provider of the global mainstream sensor chip design company. It has established an internationally leading and complete intellectual property system and patent layout, significantly improved its industrial status and market share, and effectively enhanced its technical capabilities and intellectual property system, and laid a solid technical, industry, market and customer foundation for the company's sustainable development.
