On December 16, Wu Ling, chairman of the third-generation semiconductor industry technology innovation strategic alliance, said at the Semiconductor Development Strategy Seminar that 2018 is a critical period for preparations for the industrialization of third-generation semiconductors. By 2025, the third-generation semiconductor device will account for 50% of the domestic market share in mobile communications and efficient power management; the LED general lighting market share will reach 80%, and the localization rate of core devices will reach 95%; the third-generation semiconductor The devices have achieved large-scale application in the fields of new energy vehicles and consumer electronics.
The third generation semiconductor is a wide band gap semiconductor material represented by gallium nitride and silicon carbide. At present, the improvements in device performance of the first and second generation semiconductor technology in the fields of optoelectronics, power electronics and radio frequency microwaves have approached the physical limits of materials. It is difficult to support the sustainable development of the new generation of information technology and to cope with energy and environment. It is difficult to meet the severe challenges faced by high-tech and its industrial development, and there is an urgent need to develop a new generation of semiconductor technology.
Wu Ling also said that the time for my country's third-generation semiconductor innovation and development is ripe and is in an important window period. But there are still multiple urgencies. Among them, the field of optoelectronic materials and devices is running alongside the international advanced level; power semiconductor materials and devices, and radio frequency materials and devices are running behind the international advanced level. At present, nearly 10 companies in the world have commercialized products, and Infineon mass production devices will be launched on a large scale in 2018. In addition, there are also problems such as weak industrial production lines and lack of technical teams.
Industrial Securities believes that the third-generation semiconductor equipment industry will usher in an inflection point in 2018. This round of investment is led by local mainland enterprises, and domestic equipment companies will enter the order and performance fulfillment period. As a strategic emerging industry, the semiconductor industry's technological breakthroughs and accelerated downstream investment will bring rapid expansion of equipment demand. List of concept stocks related to
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Shanghai Xinyang: The "02 special " exhibition area where participated in this conference attracted a lot of attention. Shanghai Xinsheng, in which the company has a stake, is the only 300mm silicon wafer manufacturer under construction in mainland China. Mass production is about to begin;
Changdian Technology: is the third largest semiconductor packaging and testing company in the world. After the private placement is completed, the industrial fund will become the largest shareholder, and the company will obtain a higher-level development platform.
Huatian Technology: company already has advanced packaging technologies such as TSV/bumping/FC.
Tongfu Microelectronics : The company is mainly engaged in the packaging and testing business of integrated circuits (ICs). It is currently the only packaging and testing manufacturer in China that realizes the quantitative production of high-end packaging and testing technologies MCM and MEMS.
Taiji Industrial : In 2009, the company began to officially enter the semiconductor industry, and cooperated with South Korea's Hynix on the 12-inch semiconductor packaging and testing project - Haitai Semiconductor.
statement: The stocks mentioned in this article are only for research and analysis and cannot be regarded as any buying and selling advice. You are responsible for your own profits and losses based on this and have nothing to do with the author or the company you work for.
