On September 30, the Shenzhen Stock Exchange's information disclosure showed that BYD Semiconductor Co., Ltd. had to submit additional submissions because the financial information recorded in the IPO registration application documents has expired and it needs to be submitted add

text: Original by Dongchedi Xing Qiuhong

[Original by Dongchedi Industry] On September 30, the Shenzhen Stock Exchange information disclosure showed that BYD Semiconductor Co., Ltd. has expired in the IPO registration application documents and needs to be submitted additionally. According to the relevant provisions of Article 29 of the "Regulations on the Registration Management of Initial Public Offering of the ChiNext (Trial)", its issuance registration procedure was suspended. This is BYD Semiconductor's fourth IPO suspension.

Image source: Shenzhen Stock Exchange

BYD responded: It is actively promoting related work, completing the update of financial information as soon as possible, and resuming the issuance and registration procedures. BYD pointed out that this suspension is a normal operation in the listing review process and has no adverse impact on all the work to be listed. For specific details and subsequent progress, please pay attention to the Shenzhen Stock Exchange GEM issuance and Listing Review Information Disclosure Website.

BYD IGBT chip

BYD semiconductor predecessor was BYD Microelectronics , founded in October 2004. In May 2020, BYD Shares transferred its 1.67% stake in BYD Semiconductor to Xiaomi Industrial Fund for a price of 100 million yuan. Subsequently, BYD Semiconductor launched two rounds of financing, and its valuation increased from 6 billion yuan to 10.2 billion yuan.

In the domestic market, BYD enjoys the market share of second domestic battery, first motor and electronic control, first BMS, and second IGBT respectively.

BYD Semiconductor plans to issue no more than 50 million shares

According to previous plans, BYD Semiconductor plans to issue no more than 50 million shares this time, raising about 2 billion yuan, mainly investing in key technology research and development projects for power semiconductors, high-performance MCU chip design and testing technology research and development projects, high-precision BMS chip design and testing technology research and development projects and supplementing working capital.