In the entire semiconductor field, chips can be said to be a very core part, but the technical content of chips, especially high-end chips, is very advanced, and not any company can break through such technological blockades, which leads to chips being monopolized worldwide. Speaking of the overlords in the chip field, we may have to mention TSMC.
For a long time, TSMC has been in the world's leading position in chip research and development technology. When other companies catch up with TSMC's pace, TSMC also took a step further. As we all know, chip production is absolutely dependent on lithography machine , and TSMC is the overlord of the chip field, but it is not the only one in lithography machine.
Dutch ASML's lithography machine occupies a leading position, and chip companies including TSMC are also dependent on the high-end lithography machine produced by ASML. However, according to recent news, ASML announced that the previous generation of High Na EUV lithography machines will be the last generation of NA. This news surprised Taiwan Mechanical and Electrical's Liu Deyin .
According to TSMC's development steps, mass production of 2nm chips will be achieved by 2025. To achieve chip production with such precision, a lithography machine with higher precision must be supported. And the end of ASML's lithography machine means that it will be difficult for TSMC to maintain its absolute status as a chip. How should TSMC deal with this situation?
From a global perspective, the technical content of high-end chips produced and developed by TSMC is indeed very superb. Currently, it can achieve the production of 4-nanometer and 5-nanometer high-end chips, and there are countless technology giants waiting for high-end chips in line for a mechanical and electrical chip.
However, the production of high-end chips does not only test the technical content of the chip, but also requires the technical impartment of high-end lithography machines. Without the lithography machine, the chip cannot be produced normally. If TSMC does not have a lithography machine with higher technical content, then TSMC may also be a waste of time to break through to chip production with higher precision.
At least for now, the chips produced by the EUV lithography machine produced by the Dutch ASML company can be accurate to 3 nanometers, making it the most advanced lithography machine in the world. If TSMC wants to achieve the production of 2nm chips, it must have a more advanced lithography machine. At least based on the EUV lithography machine produced by ASML, the numerical aperture will be upgraded to 0.55.
According to ASML, the next generation of High Na EUV lithography machines can indeed achieve the production of 2nm chips, but this generation of lithography machines will be the last generation. So, has the lithography machine technology really reached its end with the announcement of ASML?
It is undeniable that any industry has an end, and under the traditional model, lithography machines are no exception. Although from a theoretical perspective, electron beam lithography machines and X-ray lithography machines can achieve higher accuracy and higher chip production, from this stage, there is no complete industrial chain for large-scale production of electron beam lithography machines and X-ray lithography machines that want to achieve chips. In other words, if the Dutch ASML company cannot take the next level of High Na EUV lithography machine technology, the High Na EUV lithography machine may be really the last generation lithography machine.
As ASML's lithography machine reaches its end, it is very difficult for TSMC to achieve the production of more advanced chips, just like a skilled woman cannot cook without rice. At this time, TSMC's absolute advantage in the chip field will disappear, and from the current perspective, there is no need to wait until the mass production of 2nm chips in 2025, which is the current 3nm chip. Samsung has surpassed TSMC to a certain extent.
As of the current situation, Samsung is the only company that can compete with TSMC in the chip field. At the end of June this year, Samsung had completed mass production of three-nano chips and successfully delivered them. Moreover, the performance of the 3-nanometer chip produced by Samsung may be better than that of TSMC's 3-nanometer chips.
is not only a strong competitor that Samsung is chasing closely, but TSMC is also facing more and more competitors. For example, Intel has become the first customer of ASML's High Na EUV lithography machine, and with the full support of the United States, it is also expected to achieve higher-process chip production. So how should TSMC deal with the continuous rise of Samsung and other competitors?
TSMC can have absolute voice in chips, so its own strength cannot be ignored. TSMC has increased its layout in the field of 3D packaging. The performance of traditional chips is limiting. Under the special packaging process, even if the performance of the chip reaches its limit, it can still achieve continuous breakthroughs in chip performance by changing the layout, layout, and core particle technology in integrated circuits.
and TSMC's packaging process has also achieved corresponding results. Apple 's M1 UItra is achieved through this process. It can be seen that if the traditional chip making process cannot be broken through again, the advanced packaging industry may be the path TSMC has taken to extend its competitive advantage. Of course, it is unknown how long this technology can last TSMC.
Today's topic: ASML announced important news, but Liu Deyin did not expect that the "slap in the face" came so quickly
