Recently, the first gaming phone equipped with MediaTek 9000+ - Tencent ROG gaming phone 6 Dimensity series was officially released. On the morning of September 22, the new phone also officially launched. As early as after the launch of the ROG 6 Dimensity series, a series of test results of the new phone were released. Not only did the running scores and game performance top the market, but the strong cooling performance also attracted the attention of many consumers!
First of all, this time, the ROG 6 Dimensity series brings the ROG6 Dimensity Edition and the ROG6 Dimensity Supreme Edition respectively. Both are equipped with the Dimensity 9000+ flagship chip. The chip is built with 4nm TSMC technology and supported by Armv9 architecture. The core is a three-slave design with 1 super-large core + 3 large core + 4 medium core similar to Snapdragon 8+ Gen1. The main frequency of the super-large core Cortex-X2 has been increased to 3.2GHz. However, the ROG 6 Dimensity series is more radical in training, with the super-large core overclocking to 3.35GHz, and combined with LPDDR5X memory and UFS3.1 storage, it has brought an Antutu running score of more than 1.14 million points.
In addition, the strong cooling performance is also the biggest upgrade highlight of the ROG gaming mobile phone 6 Dimensity series this time. In order to make the performance of the Dimensity 9000+ processor unreserved, the ROG6 Dimensity version adopts a matrix liquid-cooled cooling architecture 6.0 Plus, equipped with the aerospace-grade cooling material boron nitride , and also has the support of a vacuum cavity temperature uniform plate and dual large graphene. In this way, even if large-scale games are running for a long time, the ROG6 Dimensity version can still output stably.
Not only that, ROG6 Dimensity Supreme Edition also adds a brand new cool wind tunnel valve. The design can achieve faster and more direct heat dissipation effect by opening and exposing the internal heat dissipation fins and then directly exchanging air heat.
As for what role this structure plays in the cooling of the mobile phone, in the actual test of UP master @ Li Dachui, we can see that when the cool fan is not used, the maximum temperature of the fuselage reached 48℃, and the front and rear holding parts and frames of the fuselage are also 44.5℃ and 44.6℃; and when the cool fan is turned on, the maximum temperature of the fuselage is only 39.1℃, and even the front and rear holding parts and frames of the fuselage are reduced to 38.1℃ and 37.9℃. The drop in temperature of nearly 10℃ not only allows users to feel at ease to turn on high picture quality and high frame rate mode to play games, but also experience a more comfortable temperature. This is undoubtedly the experience that gamers expect.
Of course, the above mentioned are all hardware materials for the new machine, and in order to better improve the game details experience, software optimization is naturally indispensable. The ROG Game Mobile 6 Dimensity Edition has deeply optimized the software level of the mobile phone through X mode + Hyper Engine 5.0. Among them, after X mode is turned on, the performance release can be maximized, bringing a significant improvement in the gaming experience. At the same time, the Hyper Engine 5.0 engine performs multi-dimensional adjustments from four aspects: network, control, picture quality and intelligent control, giving players strong support.
In addition, the ROG6 Dimensity version is also equipped with AirTrigger 6 ultrasonic shoulder keys, which can support single point, continuous point, press trigger dual operations, and press lift trigger respectively. As long as the key skills are placed at the shoulder key mapping point in the game, you can quickly play advanced operations such as "Resurrection Magnetic Sword", "Worshiping Buddha Spear" and other advanced operations.
So if you also like to play mobile games and pursue the ultimate experience, the ROG game mobile phone 6 Dimensity series is very worth buying.
