With its excellent architecture and TSMC's 7nm process, AMD has finally turned around, and AMD is more conscientious in supporting CPUs on motherboards. The recent generations of Ryzen series desktop processors all use the AM4 interface, and the previous generation of chipsets can often also be used. By upgrading the BIOS to support subsequent new products, it is reasonable for AMD YES to have such a high voice.
However, for gamers, especially those who like to toss and DIY, AMD's CPU still has room for improvement. Every time the radiator of the AMD platform is disassembled, it is often a little frightened, afraid of pulling out the CPU together. , in case a large piece of the pin is bent, it is not good. In contrast, the Intel platform does not have this problem.
Therefore, for AMD users, it is best to choose the radiator from the beginning, and don't disassemble it after installing it. With AMD's packaging mode, in case of bad luck, replace the radiator or silicone grease At that time, the CPU pin is GG, and the CPU needs to be replaced at that time. Of course, the probability of such an extreme situation is not high, but it is really bad.
As for why this happens, let’s talk about the encapsulated mode of CPU. Currently, there are three common modes: LGA, PGA and BGA. It is also LGA mode , BGA is directly welded on the motherboard, mobile phone processor , notebook processor are often BGA mode, and PGA mode is used by AMD desktop processors.
BGA is a direct welding mode, so there is no need for users to replace the CPU by themselves. It must be used by professional equipment, while LGA and PGA can allow users to replace the CPU in comparison, and different packaging modes also lead to CPU plug-in Slot the difference above .
The picture below is the picture of the socket of the LGA interface and the PGA interface. The CPU of the LGA platform has no pins, but the main board has pins, which is equivalent to transferring the risk of pin damage to the main board, while the CPU of the PGA platform has pins , by plugging into the motherboard CPU socket to achieve contact.
Through observation, we can see that the CPU of the Intel platform can be pressed to death by the cover, so when the radiator is removed, the probability of a miracle is very low, and the CPU of the AMD platform is not similar to the Intel platform. The protection measures are entirely based on the friction between the CPU pins and the socket to ensure the stability of the CPU, and it is normal to perform miracles with great effort.
Of course, smart netizens also have ways to avoid these problems. When , for example, uninstalls the radiator, boots and copies the CPU, and then goes to to remove the radiator , or when removing the radiator, first turned the heatsink a little, and then uninstalled , but even with this experience, it doesn't change the fact that AMD's CPUs are easier to take down. These problems should not be the user's need to worry about, in fact, it is also very easy to solve this problem, that is, adding a protective cover.
However, it has recently been reported that AMD's Zen4 architecture processor will use the AM5 interface, and its CPU will be packaged with LGA. The new processor has 1718 contacts, and the package of the and processors has the same size as the . It is the current 40×40 mm specification, so the current AM4 platform radiator may still be able to support the AM5 platform.
In addition, the new platform will support dual-channel DDR5 memory, but in terms of PCI-E support, the desktop platform still only supports PCI-E 4.0, and the server platform will support PCI-E 5.0, while its competitor Intel Alder Lake-S competes , It has been confirmed to support DDR5 memory and PCI-E 5.0, but for most users, PCI-E 5.0 will not be of great significance, so it is understandable that AMD chooses not to support it. In contrast, it is more practical to use LGA package. .
