NSF Intro and Overview (Spring 2023)

Name: NSF Intro and Overview (Spring 2023)
Uploaded: 2024-05-14T02:19:05+08:00
Description: NSF Intro and Overview (Spring 2023)

Category：hotcomm

2024-05-14

Category Latest News

At the press conference, Xu Jingquan, MediaTek’s deputy general manager and general manager of the Wireless Communications Division, revealed that in 2021, MediaTek’s share of the global mobile phone chip market has reached 40%, and “two out of every five mobile phones will be eq - DayDayNews
As for the Dimensity 8000 mentioned in the news, it is reported that it will be based on TSMC’s 5nm process, with four A78 large cores at 2.75GHz, four A55 small cores at 2.0GHz, and equipped with Mali-G510 MC6 GPU. - DayDayNews
At the beginning of the month, MediaTek’s Dimensity 8000 series officially debuted, announcing the parameter specifications and technical characteristics of the Dimensity 8100 and Dimensity 8000 chips. Prior to this, the flagship Dimensity 9000 has been launched, marking the begi - DayDayNews
#mediaTek Dimensity 8000# The OPPO Find X5 series that was exposed before the Spring Festival has finally been officially announced in the near future. A new product launch conference will be held next Thursday, February 24 at 19:00. The biggest highlight of this phone is the fir - DayDayNews
At 6 a.m. on November 19, MediaTek held its 2021 executive media conference for global media and officially released the 2022 flagship 5G SoC-Dimensity 9000, and brought 10 global firsts, directly benchmarking Apple A15 and Qualcomm’s upcoming Snapdragon 989 will fully impact the - DayDayNews
IT House reported on November 29 that MediaTek recently released the Dimensity 9000 processor globally. IT House has reported that on the 19th of this month, MediaTek officially released the Dimensity 9000 new generation flagship 5G mobile platform. - DayDayNews
With the advent of the 5G era, the follow-up research and development of 5G chips is undoubtedly a top priority. Huawei has taken the lead in launching the Kirin 990 processor that supports SA/NSA dual-mode 5G, and Samsung’s Exynos 990 and Qualcomm’s Snapdragon 865 have also foll - DayDayNews
MediaTek Xunkun 1300T is based on the company's flagship Dimensity 1200 SoC, manufactured using a 6nm process, with a 1+3+4 three-cluster core design, equipped with four large Cortex-A78 cores and four small Cortex-A55 cores. - DayDayNews
Judging from the information officially released by OnePlus, OnePlus Ace adopts a right-angle frame design in appearance. The lens module shows that it uses three rear cameras, with a main camera and two auxiliary lenses at the top. It is also the first time for 150W fast chargin - DayDayNews
The CPU part uses the Armv9 architecture, including a 3.05GHz Cortex-X2 large core, three 2.85GHz Cortex-A710 mid-core and four 1.8GHz Cortex-A510 energy-efficiency cores. - DayDayNews

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