Qiongwan 13600K new overclocking options:
MSI recently solved the limitation of B660 motherboard not being able to overclock 13th generation Core processors through a mysterious BIOS. Friends who want to experience 13th generation core overclocking but don’t want to buy a Z790 motherboard are in luck.
B660M MORTAR MAX WIFI DDR4 motherboard external clock generator, which is the key to the super FSB of the 12th generation Core non-K processor. The Intel ME engine limits the FSB to no more than 103MHz. MSI uses an old version of unlocked microcode to break the restriction. However, this version of microcode does not support the 13th generation Core.
According to the HKEPC test, after flashing the E7D97IMS.123U24 version BIOS that leaked this time, it can be successfully booted at the highest external frequency of 113MHz while the voltage remains at the Auto setting. The performance core frequency reaches 5.76GHz and the energy efficiency core frequency reaches 4.40GHz. However, you need to add 0.05V voltage through the vCore Offset setting to run the CineBench R23 test stably.
pressurized 0.1V can pass the 114MHz FSB and achieve 5.81GHz overclocking. Although it can be booted at 115MHz FSB by continuing to increase to 0.15V, overclocking to 5.86GHz will be difficult to achieve due to heat dissipation.
super FSB will not affect the DMI and PCIe clock frequencies, but you need to pay attention to the impact on the memory frequency , and you need to appropriately lower the memory multiplier. Currently, only the unlocked version of the K series is available for the 13th generation Core. The overclocking range of 13600K is more ideal than that of 13700K/13900K.
TSMC’s 3-nanometer wafer foundry price exceeds US$20,000
Although the production capacity of chips and has begun to shift to oversupply, TSMC’s monopoly on advanced processes has made TSMC confident and price increases will continue.
According to DigiTimes, TSMC’s 3-nanometer wafer quotation has reached US$20,000 per piece. TSMC also plans to increase prices by 6% in 2023, which has not affected Apple, Intel, Qualcomm, MediaTek and Nvidia to continue to place orders to book production capacity in 2023/2024. The trend of mobile phones and graphics cards becoming more and more expensive is difficult to reverse.
After losing major customers such as Qualcomm and NVIDIA, Samsung is still working hard to improve the 3nm GAA yield rate. Recently, there are reports that Samsung is catching up with TSMC in the 3nm process by cooperating with Silicon Frontline Technology to prevent electrostatic discharge to improve wafer yield.
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