These few months have been a turbulent time in the processing industry, and technology companies continue to release new products. The influx of equipment has not stopped, as TSMC has planned to move the 3nm development to the United States, and that is not the only news.

These few months have been a turbulent time in the processing industry, and technology companies continue to release new products. The influx of equipment has not stopped, as TSMC has planned to move the 3nm development to the United States, and that is not the only news. TSMC (TSMC) has appeared frequently in the news recently, and many companies released products that include the chip manufacturing company's semiconductor and process nodes.

Since 2020, the Taiwanese chip maker has reliably provided 5nm processors for AMD and even provided new 4nm nodes for NVIDIA’s most recent Ada Lovelace graphics card.

iPhone 14 also uses TSMC's 4nm process node. However, as its largest customer, Apple often gets the latest and greatest developments from its suppliers. Therefore, Apple plans to transfer to TSMC's 3nm process in iPhone 15.

Currently, TSMC only produces 3nm nodes in Taiwan. While this doesn't necessarily create any major problems or obstacles in Apple's development process, there are ways to simplify it. The two companies have an idea: to transfer all TSMC's 3-nanometer production to the United States.

In 2020, TSMC began to plan to build a processing and development factory in the United States. The initial estimate is that construction will be completed in 2021. However, after two delays, the current deadline is the first quarter of 2023. Assuming they fit this time frame, the iPhone 15 model will feature a brand new 3nm processor made in the United States.

In related news, a TSMC factory in Taiwan has begun to focus on finding breakthroughs to reach a 1nm process node. Of course, as processors become more compact, they become more difficult to sustainably produce. Therefore, TSMC engineers must find new materials and methods to reduce to 1 nanometer and smaller processes.

To this end, TSMC cooperates with MIT (MIT) and Taiwan University (NTU) to research and develop new methods. After extensive engineering and testing, they found that combining " 2D material " and "semi-metal bismuth" produces extremely low resistance, which may overcome the most challenging aspects of producing 1nm nodes.

research team confirmed that the 1nm node has several years left before the production and sale of consumer products. We won't see the current 2nm node plan until the end of 2024. Therefore, it may easily take at least five years to achieve such a breakthrough. If these breakthroughs continue, maybe we will see a picometer-sized node (1000pm=1nm) by the end of the century.