IT Home May 13th news, Micron released the industry's first 3D NAND flash memory with 232 layers on Thursday. The company plans to use its new 232-layer 3D NAND product for a variety of products, including solid-state drive , and plans to start mass production of such chips around the end of 2022.
Image source: Micron
IT Home learned that the 232-layer 3D NAND flash memory of Micron adopts a 3D TLC architecture, with an original capacity of 1Tb (128GB). The chip is based on Micron's CuA architecture and uses NAND string stacking technology to create two 3D NAND arrays on top of each other.
CuA design plus 232 layers of NAND, will greatly reduce the chip size of Micron 1Tb 3D TLC NAND flash memory, which is expected to reduce production costs and enable Micron to price devices that use these chips more competitively, or increase its profit margins.
Micron did not announce I/O speed or number of planes for its new 232L 3D TLC NAND IC, but implies that new memory will provide higher performance compared to existing 3D NAND devices, which is particularly useful for next-generation SSD with PCIe 5.0 interface.
Speaking of SSDs, Micron's executive vice president of technology and products noted that the company has worked closely with developers of internal and third-party NAND controllers for SSDs and other NAND-based storage devices to enable support for new memory.
Image source: Micron
Among its other advantages of 232-layer 3D TLC NAND, Micron also mentioned that it consumes less power compared to previous generation nodes.
Considering that Micron will start producing 232-layer 3D TLC NAND devices by the end of 2022, SSDs with new memory are expected to arrive around 2023.
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