On May 17, some media reported that TSMC announced the launch of the development of 1.4nm chip process process , and will convert its 3nm process R&D team into a 1.4nm process R&D team in June this year. At the same time, it is reported that , Samsung, will also take corresponding measures in this regard. If the news is true, it means that the technological competition for advanced processes has become increasingly fierce.
Previously, TSMC said that it is expected that the 3nm process will start shipment in the second half of this year, and large-scale mass production will be achieved in 2023, and 2nm will also be mass-produced as scheduled in 2025. Now, TSMC will start the research and development of the 1.4nm process process in advance.
TSMC's move may be related to the competition between Samsung and Intel . Previously, Samsung announced at "Foundry Forum 2021" that it will mass-produce 2nm process chips in 2025. Subsequently, the person in charge of Samsung mentioned in the board report that Samsung has made significant improvements in 3nm production capacity, with a 45% increase in logic area efficiency, a 50% reduction in power consumption, and a 35% improvement in performance. Intel also announced that it will officially enter the Amy era in 2024 and launch the first Amy era product - Intel 20A. As the "leader" in the field of advanced processes, TSMC has had to turn on the "counterattack" mode. It can be seen that although there are only three companies left in the advanced process track, TSMC, Samsung and Intel, they are still full of gunpowder and the competition is quite fierce.
However, the "fall" of advanced processes in the past two years is not uncommon. At the beginning of 2021, Samsung foundry 5nm mobile phone chip had power consumption problems, and this problem also existed in Samsung foundry 4nm mobile phone chips in 2022. TSMC's 4nm mobile phone chip also has an excessive power consumption problem. Intel has frequently fallen into the dilemma of "difficult delivery" since the 10nm process. It can be seen that as the chip process size further shrinks, technical challenges are also increasing. Although
has many difficulties, it has not hindered the competition of these three companies in the field of advanced processes. It is reported that at the TSMC's recent lecture, TSMC expects capital expenditure to reach US$40 billion to US$44 billion in 2022, and 70% to 80% of capital expenditure will be used for advanced process processes (7nm and below process processes). In 2022, Samsung not only plans to invest more than US$36 billion in semiconductors, but also claims that it will focus on improving the yield of advanced processes at the foundry business level, and strive to win the "throne" of technological leadership through mass production of the first generation of GAA processes in the first half of 2022. In addition, Intel's capital expenditure in 2022 may reach US$28 billion, and it was even rumored that it plans to entrust 3nm chips to TSMC for foundry to enhance its competitiveness in more advanced processes.
Author丨Shen Cong
Edit丨Liu Jing
Editor丨Maria
Producer丨Lian Xiaodong