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has gradually transformed recently and actively deployed in the semiconductor industry and has actively deployed in the global electronics foundry leader. Chairman Liu Yangwei pointed out that in 2019, Hon Hai Group's revenue in the semiconductor industry reached NT$70 billion. In terms of revenue amount, Hon Hai Group can rank among the top 10 companies in Taiwan's semiconductor industry.
Liu Yangwei pointed out that semiconductors will be one of the most important parts of the legal person briefing held by Hon Hai on the 12th when explaining Hon Hai's future growth momentum. In 2019, Hon Hai Group's revenue in the semiconductor industry reached NT$70 billion, 47% came from equipment and process services, the other 34% came from IC design contribution, other packaging and testing accounted for 15%, and the other 3% came from IC design services. Overall, Hon Hai Group itself already has a vertical integration capability architecture in the semiconductor industry.
In fact, in recent years, Hon Hai Group has continued to deploy in the semiconductor industry. Liu Yangwei has previously stated that the group has deployed semiconductor 3D packaging, and has also entered panel-level packaging (PLP) and deeply engaged in system-level packaging (SiP). As for chip design, including single-chip integration of 8K TV systems, small chip applications, design power chips, panel driver chips, and small control chips, they will be the focus, and it is also expected to enter the field of image-related chip design. The high-end packaging and testing plant expected to be built in Qingdao, China is expected to hold a construction ceremony in the near future. It is expected to be put into production in 2021 and reach the full capacity target in 2025. Its goal is to target 5G communications and artificial intelligence chip packaging and testing projects.
As for, it was reported that Hon Hai Group intends to invest in Anmou (ARM), a silicon intelligence financial power manufacturer under Japan SoftBank, Liu Yangwei said that Hon Hai Group holds some shares in China's ARM, and its contact with SoftBank Group is due to the investment in Vision Fund. The news about investment in ARM is not clear at present.
Hon Hai’s internal “reform”
In order to further enhance competitiveness, in January 2014, Terry Gou announced the transformation of Hon Hai’s organization and established the current 12 sub-groups, and believed that each sub-group would have at least 3-5 listed companies in the future.
Among them, S Group, established in 2017, is mainly semiconductor components. It is reported that S Group's main technical services include chip design, wafer manufacturing, packaging and testing.
According to Digitimes, S Group has semiconductor equipment factory Jingding, packaging and testing factories Xinxin, Futaikang, GlobalFoundries' IC design service company Hongjing, which was acquired in 2014, and Sharp 8-inch factory Fab 4. The chip design includes driver IC manufacturers Tianyu, Sharp ED, etc.
According to the Central News Agency, former Hon Hai President Terry Gou said that after acquiring Sharp (in 2016, Hon Hai acquired Sharp for US$5.3 billion), it will develop in 8K connected TVs in the future. Therefore, Hon Hai hopes to run its own semiconductor factory and further design and produce the chips needed by itself.
In the next development process, it has to be mentioned that the change of the candidate for Hon Hai Chairman has brought about the changes in this company. According to Tencent Technology citing Taiwanese media reports, Hon Hai held a shareholders' meeting last June to re-elect the chairman. After the meeting, Hon Hai announced that its chairman would be taken over by Liu Yangwei and Li Jie would be the vice chairman. The new chairman Liu Yangwei was previously the general manager of S Group.
Under the leadership of Liu Yangwei, Hon Hai will further pay attention to its layout in semiconductors. (We mentioned at the beginning of the article that Hon Hai’s establishment of Hon Hai Research Institute this year and its clear layout in the semiconductor field in the financial report meeting are good examples.)
’s multi-point layout for semiconductors
Judging from its performance in recent times, Hon Hai’s investment in the packaging and testing field is particularly eye-catching.
According to public information, in the field of semiconductor packaging and testing, Hon Hai will layout semiconductor 3D packaging, panel-level packaging (PLP), and system-level packaging (SiP).
From the perspective of progress, according to the content of the Hon Hai financial report conference call recorded by the semiconductor weather vane, Hon Hai has the ability to conduct SiP. Hon Hai's subsidiary Xunxin Technology Holdings Co., Ltd. is a packaging and testing company for professional system modules, so SiP is not unfamiliar to Hon Hai. In terms of advanced packaging, the company plans to establish some advanced packaging capabilities in Chengdu. Its goal is to have such packaging products from the end of 2021 to 2022.
In addition to the packaging and testing project, Foxconn also invested in related companies such as Jingding Precision Technology, semiconductor device manufacturer Jingding Precision Technology, semiconductor module packaging and testing manufacturer Xunxin Technology, LCD driver ICs design company Tianyu Technology, semiconductor and LED manufacturing equipment manufacturer Peixin Energy Technology, IC design service company Hongjing Technology and other related companies.
After 2018, Foxconn's investment in the semiconductor field has become more and more frequent. Foxconn has successively made arrangements in Zhuhai, Shandong, Nanjing, Qingdao and other places.
According to media reports in August 2018, Foxconn signed an agreement with the Zhuhai government to start the construction of a 12-inch wafer fab in Zhuhai in 2020, with a total investment of US$9 billion. According to the Nikkei Shimbun, the semiconductor factory invested by Hon Hai Foxconn in Zhuhai is expected to be used to produce chipsets used for ultra-high image quality 8K TVs and camera image sensors, as well as sensor chips for other industrial or wiring devices. The report said that Hon Hai hopes to reduce its dependence on Apple through this plan. But in fact, there seems to be no follow-up to this project.
Two months later, Foxconn took action again and cooperated with the Jinan Municipal Government of Shandong Province to establish a RMB 3.75 billion investment fund to promote the development of the semiconductor industry in Shandong Province. According to the agreement reached with the Jinan Municipal Government, Foxconn will use the group's resources to assist in the establishment of five IC design companies and one high-power semiconductor company in Jinan.
htmlIn November, Foxconn's Jingding Precision Nanjing Semiconductor Industry Base and semiconductor equipment manufacturing project were officially signed, with an investment of RMB 2 billion, mainly focusing on high-end semiconductor equipment.In March 2019, a new factory opened in Nanjing by the subsidiary of Foxconn Group and semiconductor equipment manufacturer Peixin Energy Technology Co., Ltd. has broken ground.
On June 11, 2020, Foxconn 5G mmWave Connector participated in the signing ceremony of major projects in Kunshan City. It is reported that the total investment of Foxconn's 5G millimeter wave connector project is US$1.008 billion, and it will engage in the research, development, production and sales of 5G mobile phone millimeter wave connectors, with an annual output value of 10 billion yuan.
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