● This is the world's first true single-chip MEMS speaker, providing high-fidelity, full bandwidth audio and low THD, ideally suitable for various personal audio devices, such as true wireless stereo (TWS) headphones, in-ear headphones, and headphones, etc.;
● This MEMS speaker uses a high-precision, high-consistency single-chip semiconductor process to replace the factory assembly and production of voice coil speakers for decades (such as dynamic coil and dynamic iron headphones);
● As the world's first IP 57-level micro speaker, it can be waterproof and dust-proof without special protection networks or coverings;
● The world's first SMT-ready speaker;
● Engineering samples can be provided now and are expected to be mass-produced in early 2021.
According to Mams Consulting, xMEMS Labs recently announced the launch of the world's first true single-chip MEMS speaker: Montara. The birth of Montara is a small step in the audio field, but a big step in the MEMS speakers. It can provide high-fidelity, full-bandwidth audio and low total harmonic distortion (THD) features for a variety of personal audio devices such as TWS headphones, in-ear headphones, and headphones. xMEMS, which has always been very low-key, has thus redefined "voice". Montara is also the world's first IP 57-grade micro speaker, which provides excellent water and dust resistance. Montara will provide consumers with a better audio experience through higher resolution, rich details, extremely low latency, excellent water and dust resistance and longer listening time.
According to xMEMS, Montara's important target market in the early stage is the upcoming waterproof true wireless headphones. Montara adopts a high-precision, high consistency single-chip semiconductor process, aiming to directly replace the currently commonly used dynamic coil and dynamic iron speakers. Next, xMEMS will drive changes in smartphone speaker design. In the future, xMEMS will also develop new MEMS speakers for applications such as home audio and car speakers.
xMEMS was established in January 2018. The company currently has 10 authorized patents and more than 70 patent applications are under review. xMEMS core team members have previously worked for companies such as TDK, Invensense and Knowles, designing many successful devices for consumer electronics applications, delivering billions of them. Currently, xMEMS is headquartered in Santa Clara, California, USA, and has an office in Zhubei, Taiwan. xMEMS plans to show its strengths in the audio field with its high-performance, small-sized piezoelectric MEMS speaker solutions.
Montara reduces the packaging height by building the entire speaker (actuator, diaphragm) on a silicon wafer and eliminates the driver matching and calibration required due to the inherent consistency of the diaphragm, surpassing the early hybrid MEMS speakers. Montara's innovative design and single-chip piezoelectric MEMS manufacturing achieves precise driving, high-quality sound, and speaker consistency and repeatability.
xMEMS conducted multiple performance tests and comparison analysis of its first true MEMS speaker, and the results show that the design is an ideal solution for earbuds and headphones. Montara displays greater volume throughout the frequency range, with excellent treble and good bass performance, wide dynamic range, and extremely low THD. The standard Montara uses 6 sounding units, which can provide up to 113 dB of SPL (measured with IEC60318-4 coupler). More importantly, semiconductor processes used in devices can achieve highly consistent diaphragm motion, which is crucial for applying active compensation to improve THD results.
This is in sharp contrast to the voice coil-driven speakers that are more different from traditional factory assembly and production. These speakers are difficult to match, and the delivered products often have differences between left and right channels. Compared to the dynamic iron speaker, the Montara is smaller in size, very lightweight (only 1 mm thick), lighter in weight, more flexible in place in compact earplugs, and SMT-ready, supports straight or side sintered engagement. The manufacturing of
xMEMS pure silicon MEMS speakers is very different from that of traditional speakers. Its piezoelectric MEMS speakers are designed like other silicon chips, essentially a single chip made through typical lithography, etching and other processes.Due to this overall design, the complexity of its production line is greatly reduced compared to the voice coil speaker. Because the design of voice coil speakers has components that require a large number of precise assembly, this production method usually requires a factory with a scale of thousands of people.
Although xMEMS would not disclose the actual process nodes of the design, it is expected to be in the range of 0.18 to 0.35 microns, and xMEMS confirms that it is currently completed on 200 mm (8-inch) wafers.
In addition to simplifying production and manufacturing, another major advantage of MEMS speakers adopting lithography technology is that their manufacturing accuracy and repeatability are significantly better than voice coil speakers. In addition, its mechanical design also has key advantages, such as a more consistent diaphragm that can provide higher responsiveness and lower THD, resulting in better active noise reduction.
xMEMS Montara Piezoelectric MEMS speakers integrate 6 so-called speaker "units" in an 8.4 mm x 6.05 mm (50.9 mm²) package. The frequency response of this speaker covers the entire range from 10 Hz to 20 KHz, which is difficult for current dynamic or dynamic speakers to reach. Therefore, we can see that multiple dynamic or dynamic speaker units are used in many headphones to cover different frequency ranges.
According to xMEMS, this design has very good distortion characteristics and is comparable to high-end planar diaphragm speakers, with THD in the range of 200 Hz to 20 KHz only 0.5%.
Because these speakers are capacitive piezoelectrically driven rather than current, they are able to reduce power consumption to a fraction of a typical voice coil driver, at just 42 µW.
In addition, size is also a key advantage of the new technology of xMEMS. Currently, xMEMS is manufacturing a standard packaging solution with sound vertically emitted from the front of the package with a shape of 8.4 mm x 6.05 mm x 0.985 mm. In addition, xMEMS will also launch a side-sintered version that can help manufacturers better manage the internal design and component placement of their headphones.
The picture above is a 3D printed headphone unit that has not been optimized for any acoustic design. xMEMS can easily design headphones with similar sizes for its MEMS speakers. In fact, a true commercial product certainly looks better, able to better take advantage of the space advantages that its speaker design offers.
capacitive piezoelectric MEMS speakers need to be noted that it requires a amplifier design that is different from traditional speakers. Montara can push up to peak peak signals up to 30 V, which is much higher than the design range of existing amplifiers. Therefore, customers who want to apply MEMS speaker design need additional supporting chips, such as Texas Instruments' LM48580.
TWS headsets are obviously Montara's main target market. TWS headsets can solve amplifier problems when designing, and such products can take full advantage of Montara's size, weight and power consumption.
In the test, xMEMS used the aforementioned 3D printed headphone prototype to demonstrate that the SPL of Montara piezoelectric MEMS speakers is significantly better than other headphone solutions, and the production version fully achieved the target 115 dB SPL (the six MEMS units in the prototype only work 5). Its natural frequency response is much higher at higher frequencies, providing enough room for suppliers to adjust and filter sound signals in their design. Because, filtering at these frequencies is much easier than enhancing.
cost, xMEMS did not disclose any figures, but it is said that its cost is at the same level as the dynamic iron unit. xMEMS's Montara speakers are currently delivering samples to manufacturers and are expected to start mass production around the spring next year, and are expected to see suppliers' commercial products at that time.
Availability
Montara's sample and evaluation kit is now available to customers and is expected to be mass-produced in the first quarter of 2021. Montara will be available in two LGA packages: Standard (6.05 mm x 8.4 mm x 0.985mm) and Side-engine (6.05 mm x 1.0 mm x 8.4 mm).
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