The annual iPhone is here again. Although the update brought by Apple this time is not as big as before, it still cannot resist the enthusiasm of consumers, especially the brand new bright black. Without further ado, let us immediately enter the disassembly of the iPhone 7 Plus.
Apple A10 Fusion processor and M10 motion coprocessor
32, 128 and 256GB storage (gloss black without 32GB version optional)
5.5 inch 1080P resolution Retina HD display (401ppi)
12 million pixel wide angle (f/1.8) lens and telephoto (f/2.8) lens, 2x optical zoom and 10x digital zoom
7 million pixel FaceTime HD Front camera (f/2.2), up to 1080P video recording
new solid-state touch home button, supports vibrating motor (Taptic Engine) physical feedback
802.11a/b/g/n/ac WiFi + MIMO Bluetooth 4.2 + NFC
iPhone 7 Plus is almost the same as the body size of the previous generation (158.2 x 77.9 x 7.3mm), and now there is a new model: A1785.
For users who like black, this time, not only has a brand new black (the space gray no longer exists), but also a more attractive bright black color scheme. In addition, the old color scheme: silver and rose gold. At the same time, this generation has changed the ugly antennas in the past. The current antenna opening design is more beautiful. In terms of appearance, a more obvious change is that the 3.5mm headphone interface has been removed and the Lighting headphone cable is changed.
Before we disassemble the eight pieces, use X-ray to see it. As you can see, the 3.5mm headphone jack no longer exists, and sacrifices have been made to make room for the Taptic Engine.
3.5mm Although the headphone jack is gone, the plum-shaped screws are still retained, which makes it much easier for us to disassemble.
After removing the screws, use the suction cup to pry the screen up, and then use the clip to remove the adhesive.
We can find that the adhesive this time is more difficult than on the iPhone in the past. It can be seen that this is intentionally done to achieve waterproof function.
During the disassembly, you can see a large amount of black and white adhesives, which are still to achieve the waterproof performance of IP67.
continue to disassemble, we can see that there are triangular screws that fix the cable rack, and the cables under the cable rack are covered with the battery connection and the two display screens.
We then use the tool to remove the cable rack from the 7 Plus internal components.
The mechanical Home key no longer exists, and now Taptic Engine is used to simulate real physical press feedback.
Apple still uses a pull strap on the battery, which can easily pull the battery out, but you need to remove many screws before.
Now you can see the battery itself.
You can see that it is marked 3.82V and 11.1Wh. It is converted to 2900 mAh, which is larger than the 6s Plus (2750 mAh), but it is still a little smaller than the one on the 6 Plus. Apple claims that the battery life is one hour better than the 6s Plus.
iPhone 7 Plus uses dual cameras, dual sensors, dual lenses and dual connection cables this time.
Two 12-megapixel cameras, a wide-angle lens like the 4.7-inch iPhone 7 (with optical anti-shake ), and a telephoto lens (no optical anti-shake), which Apple claims are 60% faster than the previous generation and 30% power savings.
can be seen under X-ray, one of the cameras is covered by four metal pads, and we guess that one should be used to turn on optical anti-shake.
7 The motherboard disassembly of Plus is much easier than the previous generation, so you can unconnect without turning it over.
Tear off the EMI (electromagnetic interference) sticker, and you can see that some new thermal management systems seem to be added.
motherboard has been removed, let's see what it is.
Red: Apple A10 Fusion APL1W24 SoC is equipped with 3GB LPDDR4 memory (marked with K3RG4G40MM-YGCH)
Apple's A10 processor part model is APL1W24,339S00255 (A9 is APL1022,339S00129), we are not sure what "W" means in the A10 model. Our iPhone 7's A10 processor comes from TSMC. Do you still remember the iPhone 6s? Its A9 processor is provided by both Samsung and TSMC. We are not sure whether this A10 processor is provided by Samsung.
Through the photos, we can see that the mold part model of A10 is TMGK98, and the A9 is TMGK96. The A10 processor has an area of about 125 square millimeters, and it is not yet possible to determine what mold technology is used.
No matter what technology is used, the A10 processor is super thin. I believe it should be using InFO packaging technology. Located below the A10 processor is Samsung K3RG1G10CM 2GB LPDDR4 memory, which is very similar to the one on the iPhone 6s. Through X-rays, you can see that the four chips are not stacked together, but are tiled. This arrangement also greatly reduces the height of the package. The memory uses package stacking technology, and combined with the A10 InFO packaging technology, the overall height is greatly reduced.
Orange: Qualcomm MDM9645M LTE Cat.12 Modem
Yellow: Sijiaxun 78100-20
Green: AVA High AFEM-8065 Power Amplifier
Light Blue: AVA High AFEM-8055 Power Amplifier
Dark Blue: Huanxu Electronics O1 1R Touch screen controller
Let’s look at the back of the motherboard
Red: Toshiba THGBX6T0T8LLFXF 128 GB NAND Flash
Orange: Murata 339S00199 WiFi/Bluetooth Baseband
Yellow: NXP 67V04 NFC controller
Green: DIALOG 338S00225 Power management chip
light blue: Qualcomm PMD9645 Power management chip
Dark blue: Qualcomm WTR4905 Multimode LTE transceiver
Purple: Qualcomm WTR3925 RF transceiver
In addition, there are many other ICs on the back:
Red: Apple/Cirrus Logic 338S00105 Audio codec
Orange: Cirrus Logic 338S00220 Audio amplifier x 2
Yellow: Lattice Semiconductor ICESLP4K
Green: Sijiaxun 13702-20 Diversity Receive Module
Light Blue: Sijiaxun 13703-21 Diversity Receive Module
Dark Blue: Anhuagao LFI630 183439
Purple: NXP 610A38
Red: TDK EPCOS D5315
Orange: Texas Instruments 64W0Y5P
Yellow: Texas Instruments 65730A0P Power control chip
has a strip cable attached to the Lighting interface, which is connected to the microphone, and both are firmly attached to the speaker opening.
At the same time, the entire Lighting interface module is very large, and different from the materials used in the Lighting interface of the previous generation iPhone, the Lighting interface of the iPhone 7 Plus uses rubber pads to ensure its waterproof performance.
Let’s take a look at the speakers now, and you can see that there are some spring contacts and waterproof mesh. The speaker is designed the same as the 6 Plus and 6s Plus, and there is also an antenna attachment.
IP67 Waterproof and dustproof are one of the highlights of the iPhone 7 Plus, so how does it achieve waterproof performance?
card pin has rubber ring
card slot and rubber ring
rubber rings Although they are not new, they can achieve waterproofing well. However, one disadvantage is that if your iPhone 7 Plus SIM card slot is lost, you need to make sure that it supports waterproofing while replacing the new card slot.
After removing a few Philips screws, you can see the handset under the front camera. The handset of the iPhone 7 Plus also supports the speaker external function for the first time.
Red: Front camera
Orange: Microphone
Yellow: Handset/speaker
Green: Distance sensor and light sensor
There are many triangular screws for fixing Home keys and LCD shielding board.
But fortunately, there is no adhesive in this place, and the cables are all well placed together.
Home key, but it is no longer a physical key, but a touch-type key.
Now remove the mute key, and there are also gaskets on it, as well as other key parts.
Disassemble the family photo
Translation and text from: IFIXIT
