IT Home reported on April 18 that DITGITIMES reported that Intel's IDM2.0 strategy is continuing. In addition to actively seeking TSMC's advanced production capacity support, it has also been recently exposed by the supply chain that it will further expand outsourcing.
chip packaging and testing supply chain practitioners said that Intel's PC chipset component, which had a relatively high internal proportion, is expected to further expand outsourced orders in the later packaging and testing of the PC chipset factory. It is also rumored in the industry that Licheng Group, which has close cooperation with Intel, will be the first to qualify, and will see the clues as early as the second half of 2023.
Since Pat Gelsinger became Intel CEO, Intel has begun to change its thinking and has begun to develop a larger and more flexible IDM foundry business in light of the situation in the semiconductor industry. Intel calls this business model IDM 2.0, requiring Intel to produce most of its products themselves, outsource some of the products to foundries, and also produce chips for third-party customers.
In addition, there were reports that Intel will open the soft and hard core license of the x86 architecture, allowing customers to mix different CPU IP cores such as x86, Arm and RISC-V in customized design chips made by Intel.
In this case, Intel's own production capacity has been locked by products such as the 12th generation Core. If you want to participate in the foundry business, you need to entrust other less important businesses, such as chipsets, graphics card GPUs in the motherboard, etc.
IT Home learned that Licheng Technology is a semiconductor packaging and testing manufacturing service company in Taiwan Province, China. It was founded in 1997 and ranks fifth in the world in this industry.
