There is one thing in the IDM 2.0 plan that in the future, Intel will no longer stick to its own wafer factories, and will open its own wafer factories for foundry, and its own chips will also seek third-party foundries to produce them as appropriate.

2025/06/0821:47:35 hotcomm 1459

After Intel new CEO Pat Gelsinger officially took office, he proposed the IDM 2.0 plan.

There is one thing in the IDM 2.0 plan that in the future, Intel will no longer stick to its own wafer factories, and will open its own wafer factories for foundry, and its own chips will also seek third-party foundries to produce them as appropriate. - DayDayNews

has one mention in the IDM 2.0 plan that in the future, Intel will no longer stick to its own wafer factories, and will open its own wafer factories for foundry, and its own chips will also seek third-party foundries to produce them as appropriate.

There is one thing in the IDM 2.0 plan that in the future, Intel will no longer stick to its own wafer factories, and will open its own wafer factories for foundry, and its own chips will also seek third-party foundries to produce them as appropriate. - DayDayNews

As one of the few chip companies with its own wafer fabs, Intel has only used its own wafer fabs to produce important chips for a long time.

However, with the breakthrough in process technology of third-party fabs, competitors using advanced process foundries have gradually gained advantages in process and other aspects compared to chips produced by Intel's own fabs.

However, with Kissinger coming to power and opening up OEM, this situation may ease in the future.

There is one thing in the IDM 2.0 plan that in the future, Intel will no longer stick to its own wafer factories, and will open its own wafer factories for foundry, and its own chips will also seek third-party foundries to produce them as appropriate. - DayDayNews

At the architecture day last week, Intel announced a detailed plan for cooperation with TSMC - Intel's new independent graphics card microarchitecture Xe HPG will be manufactured by TSMC and manufactured using TSMC N6 process nodes.

According to Stuart Pann, senior vice president of Intel enterprise planning division, currently, 20% of Intel's products are handed over to external foundries, and Intel has become one of TSMC's top customers. However, before, Intel's cooperation with foundries mainly focused on specific product lines such as Wi-Fi modules, chipsets, or Ethernet controllers, . These products use mature process nodes to complement Intel's own advanced process technology.

"Just like our designers select the right architecture for the right workload, we will also select the most suitable process node for the architecture, and it is appropriate to use foundry process nodes for Intel's independent graphics card products." Stuart Pann said.

There is one thing in the IDM 2.0 plan that in the future, Intel will no longer stick to its own wafer factories, and will open its own wafer factories for foundry, and its own chips will also seek third-party foundries to produce them as appropriate. - DayDayNews

In addition, in a recent interview with foreign media, Intel CEO Pat Kissinger did not directly comment on whether he would acquire GlobalFoundries, but he said: "M&A requires willing buyers and willing sellers, and I am willing buyers. Intel will continue to maintain interest in acquiring chip manufacturing companies."

"This industry will be integrated, and this trend will continue for a long time. I expect Intel to become an integrator." Pat Kissinger said in an interview.

There is one thing in the IDM 2.0 plan that in the future, Intel will no longer stick to its own wafer factories, and will open its own wafer factories for foundry, and its own chips will also seek third-party foundries to produce them as appropriate. - DayDayNews

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