Berryan has a complete vertically integrated manufacturing capability, focusing on the overall manufacturing process design of the product, focusing on each manufacturing link, and is equipped with advanced manufacturing and processing equipment, such as surface mount (SMT), PCB board-mount wafer packaging (COB), automatic screw tightening, ultrasonic welding (Ultrasonic), pulsed hot-press welding (Hot bar), robot welding, connector crimping (Process-fit), wire harness processing (Cable Harness), whole machine potting (Potting), surface coating (Conform Coating), overall assembly (Box Build), and product aging (Brun-in). All configurations of production equipment have been integrated into the MES system for efficient system and traceability management.
Advanced Equipment
We provide products from circuit board assembly to assembly of the entire machine, including special process methods for technical integration of all processes and customized product. Provide customers with lead-free process (RoHS) requirements, including some traditional process requirements.
■ According to customer requirements, process design analysis is performed using the BRIO manufacturing design baseline for the process design
■ products are produced based on international standards, such as J-STD-001/IPC
High-level manufacturing capacity
Surface mounting
web printing (solder paste, adhesive), such as laser, step-type web board
online SPI (3D solder paste detection)
Online dispensing
NPM series patch machines Latest technology as small as 01005 Parts implementation
Provides reflow soldering/air reflow soldering
Pin-in-paste (through hole reflow) process in inert gas environment PoP
placement (chip stacking) process
AOI (online optical detection machine)-SMTh
Circuit board welding and whole machine assembly
Custom installation part molding
manual plug-in
wave welding parts, manual welding Connection, robot welding, pulse hot press welding, ultrasonic welding
laser marking
connector crimp (Process-fit)
PCBA cleaning (ultrasonic cleaning, deionized water washing, manual solvent cleaning)
PCBA segmentation (Routers, Punches, V-CUT)
AOI (offline optical detection machine)-DIP
circuit board protection (surface coating (acrylic, UV, polyurethane…), potting (Epoxy…)
circuit board chip binding (COB)
micro-area clean assembly
whole machine assembly/packaging
product test
ICT circuit board test
whole machine assembly test
whole machine assembly test
routine test (high voltage test, insulation test, leakage test, impedance test)
product whole machine aging
whole machine structure parts, packaging material customization corresponds to
Provide services such as plastic injection, aluminum extrusion/dimet casting, sheet metal processing, CNC processing, etc., vertically integrate upstream and downstream resources, and provide customers with the most complete one-stop needs.
Intelligent warehousing management
In a certain range of factory warehouses, the FIFO management of raw materials is effectively carried out, and the system manages periodically. Therefore, the resource adjustment and data management of inventory is effectively managed, and the inventory can be accurately and effectively traced the time and material information of inventory. In addition to the management of raw materials, the customer's Turnkey direct shipment service is provided, and the final packaging product can be sent directly to the sales outlets, or directly sent to consumers to realize closed-loop management of the product.
