Zhidongxi (public account: zhidxcom) | Yunpeng
Zhidongxi reported on March 25 that according to foreign media reports, mainstream CMOS image sensor (CIS) packaging and testing companies such as Tongxin Electronics and Jingcai Technology are currently expanding their production capacity. As multi-lens smartphones become increasingly mainstream, the market demand for CIS is also growing rapidly.
Most of the production lines of these two Taiwanese companies are now running at full capacity. Although the COVID-19 epidemic will significantly reduce global smartphone shipments in 2020, manufacturers are mainly promoting multi-lens combination smartphones in the first quarter of this year, so the demand for CIS is still very strong in a short period of time.
Some industry sources said that leading CIS manufacturers, including Howie Technology, have begun to plan production capacity from wafer manufacturing plants, so packaging and testing companies like Tongxin Electronics and Jingcai Technology usually obtain clear orders one year in advance, thereby inspiring them to increase production capacity as soon as possible.
It is reported that Tongxin Electronics' production capacity will increase to 150,000-160,000 pieces per month (8-inch wafers) in the third quarter of 2020, doubled. Heinz Ru, head of
Tongxin Electronics, said that their factories in Taipei and Taoyuan, northern Taiwan are operating at full capacity to meet customer demand for CIS and other IC components.
Currently, the Philippine government has restricted road transport to prevent the spread of the epidemic, which has some impact on Tongxin Electronics' factories in the Philippines.
Article source: Digitimes
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