It had been losing money in the U.S. market for several consecutive years; Russia began to develop its own lithography machines; it was unable to ship EUV lithography machines to the Chinese market; and Japan's Canon developed a 3D lithography machine. Everyone was worried about

2024/05/1823:21:32 digitals 1079

had been losing money in the US market for several consecutive years; Russia began to develop its own lithography machine ; it was unable to ship EUV lithography machines to the Chinese market, and Japan Canon developed a 3D lithography machine. Everyone is increasingly worried about ASML. But what none of us expected was that after the so-called "turmoil", the situation of ASML suddenly changed.

It had been losing money in the U.S. market for several consecutive years; Russia began to develop its own lithography machines; it was unable to ship EUV lithography machines to the Chinese market; and Japan's Canon developed a 3D lithography machine. Everyone was worried about  - DayDayNews

First, Intel stated that they would purchase a new generation of lithography machines from ASML. Then senior executives of Samsung personally went to ASML's headquarters, hoping that ASML could give priority to supplying lithography machines to Samsung, and then the relevant cooperation was finalized. Finally, TSMC also expressed its intention to purchase new lithography machines from ASML. Obviously, in the next orders, the three major chip giants have given ASML a better situation. But there are some companies that don't let ASML have an easy time.

It had been losing money in the U.S. market for several consecutive years; Russia began to develop its own lithography machines; it was unable to ship EUV lithography machines to the Chinese market; and Japan's Canon developed a 3D lithography machine. Everyone was worried about  - DayDayNews


Just recently, AMD officially announced that the new generation of Zen4 architecture chips will be produced using TSMC’s 5nm chip process. In this chip, AMD will use chiplet packaging technology to improve the performance of the chip. In other words, AMD no longer pursues more advanced processes to improve chip performance, but adopts chip packaging technology.

This means that to a certain extent, AMD's chips are reducing their dependence on ASML's new generation of lithography machines. Once chip customers reduce their dependence on them, the more advanced processes of chip foundries will not be so popular and will inevitably change according to customer needs. Therefore, under the official announcement like AMD, the future development of ASML will not be easy.

It had been losing money in the U.S. market for several consecutive years; Russia began to develop its own lithography machines; it was unable to ship EUV lithography machines to the Chinese market; and Japan's Canon developed a 3D lithography machine. Everyone was worried about  - DayDayNews


In this regard, foreign media also said: ASML may be "planted" in the hands of US companies. The reason why

says this is probably due to the packaging technology of this chiplet. According to the definition of the industry, this packaging technology breaks the existence of Moore's Law and will bring new opportunities to the entire semiconductor industry chain. After all, in terms of the current progress of the process, TSMC and Samsung are beginning to lay out their 3nm, and TSMC's 2nm is also advancing. believes that it will not take long to reach Moore's Law. By then, the entire semiconductor industry chain may fall into a "dead situation." Once the photolithography machine is unable to develop the production of more advanced processes, the ensuing "crisis" will be obvious. Therefore, chiplet packaging technology has become the focus of research by many companies.

It had been losing money in the U.S. market for several consecutive years; Russia began to develop its own lithography machines; it was unable to ship EUV lithography machines to the Chinese market; and Japan's Canon developed a 3D lithography machine. Everyone was worried about  - DayDayNews


is just right. AMD is the main force in this packaging technology, and it is AMD that can do the best in this application. In addition to AMD, TSMC, Intel, NVIDIA, etc. have all launched layouts in this technology field. We can see that most of them are American companies. The most important thing about is that before this packaging technology was deployed on a large scale, ASML's status in the US market was not very good. Because at that time they were very cautious about ASML's lithography machine technology. Not to mention , when the scale continues to expand, the attitude of US companies towards ASML lithography machines will change. And once they do this, it cannot be ruled out that it will cause a chain reaction.

It had been losing money in the U.S. market for several consecutive years; Russia began to develop its own lithography machines; it was unable to ship EUV lithography machines to the Chinese market; and Japan's Canon developed a 3D lithography machine. Everyone was worried about  - DayDayNews


To be precise, this chain reaction is already expanding. According to data, Chiplet's global market forecast analysis will reach an ecological scale of US$5.8 billion in 2024, and may exceed US$57 billion by 2035. Obviously, in the future, more companies may choose to improve chip performance based on packaging technology.

It had been losing money in the U.S. market for several consecutive years; Russia began to develop its own lithography machines; it was unable to ship EUV lithography machines to the Chinese market; and Japan's Canon developed a 3D lithography machine. Everyone was worried about  - DayDayNews


So on this basis, the future situation of ASML may be really bad for and . How do you view this matter? Welcome to leave comments, like and share!

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