AMD Ryzen 7 5800X3D is the world's first 3D V-Cache CPU chip. After degumming, its heat dissipation effect is better than the original device. Twitter user Madness7771 posted a photo of an unmoulded AMD Ryzen 7 5800X3D CPU. This is the first time we've seen the chip under its package.
As expected, the 5800X3D uses a CCD and an IOD, surrounded by a large number of capacitors . Like all other Ryzen 5000 CPUs, the 5800X3D features a soldered design, using liquid metal TIM (thermal interface material) and gold-plated solder for more efficient heat transfer between the IHS (integrated heat sink) and the chiplet. The parts of the
CPU that do not need to be in contact with the IHS are protected by silicon, including the solder joints of the second CCD. Although they do not physically exist, they have been sealed with silicon. No matter what kind of CPU it is, the degumming process is a difficult process, and the various capacitors added to the periphery of the board make the operation more difficult. But the skilled Gaowan did not let a single capacitor be damaged during the whole process.
Another difficulty is that AMD Ryzen 7 5800X3D has a layer of L3 SRAM cache on the 3D packaged CCD. This thin layer is very fragile. In addition, AMD has to lower the clock frequency and voltage of the main CCD itself to avoid damaging the V -Cache. This is why overclocking is not "officially" allowed, although many people have found ways around it, but the V-Cache still generates high temperatures even after thermally constraining the chip.
Madness7771 reports that he previously measured temperatures of 90C on an AMD Ryzen 7 5800X3D, but this is no longer the case. He didn't provide any details about the cooling used on the chip, or whether he placed the debonded chip directly under a heatsink. The second process is a bit dangerous, because applying more pressure can cause physical damage to the chip, or not enough pressure can create air pockets at the air connection, which in turn reduces heat dissipation efficiency.
