introduced many new devices. Among them is the protagonist of our dismantling analysis today-Xiaomi Sound, a high-fidelity smart speaker. The whole device not only looks weighty, but it also feels weighty when you hold it in your hand. So let's turn on this device today and take a look at its internal hardware, right?
Dismantling steps
First dismantle from the bottom, and the bottom non-slip pad is fixed by double-sided tape.
rubber pad There are screws underneath. Unscrew the screws and take off the bottom cover. The bottom cover is made of ABS. Remove the bottom shell, you can see that the motherboard is also fixed with screws, there are two ZIF connectors, and black foam glue is attached to them.
There is also a connector fixed on the back of the motherboard. Unscrew the screw, disconnect the connector, and remove the motherboard. Below the motherboard is a black metal heat sink, and the speaker is connected to the motherboard through shrapnel.
There is thermally conductive silicone grease above the main board shielding cover. Take off the shielding cover. The shielding cover is a double-layer shielding cover + shielding cover style, and the inner side also has thermally conductive silicone grease.
The shell is made of plastic and can be taken out directly.
Remove the bottom cover bracket, and fix the power interface on the bottom cover bracket with screws. Unscrew the screw, you can take it off directly.
There is a double suspension passive radiator on the inner support, and there is an FPC connection soft board on one side.
WIFI antenna and UWB small board are fixed on the inner support by double-sided tape,Just take it off.
The heat sink is fixed with double-sided tape. Before removing the module, separate the FPC soft board.
Unscrew the screw, you can take off the top cover, the sound hole cover is provided with a buffer rubber cap.
FPC cable has a fixed positioner. Unscrew the screw, remove the locator, and separate the sound control cover and touchpad. The output sound control cover is made of metal with nylon mesh on the top.
Unscrew the two screws at the bottom of the touchpad to separate the bottom plate. The soft board is directly connected to the LED light board, the connector interface is also pasted with black plastic tape, and there is a ZIF interface to connect the touch sensor. After removing the LED board, three button sensors can be seen on the touch panel.
Finally, take the speaker, you need to unscrew the screw first. It can be seen that there is a large piece of white solid glue at the internal interface of the sound cavity, which can be taken out after prying it off.
The inner cushion of the full-range speaker is sealed and waterproof and reduces cavity resonance. The speaker wire is wrapped in foam, and the wire through hole is sealed with a lot of glue.
E analysis
Let’s take a look at the main IC on the motherboard:
1: Allwinner-R329-Highly integrated Soc3
p0S-R329-XKI0256: HT-P0256 8) 3.3V NAND flash memory3: Realtek-RTL8733BS-WiFi and Bluetooth Combo single chip
4: TI-TAS5825M- audio amplifier
5: Knowles-microphone
UWB module has The shielding cover marked by Xiaomi,After removing it, you can see that it is the DW3210 UWB chip of decawave, which is a second-generation fully integrated pulse radio ultra-wideband (UWB) wireless transceiver DW3000 series. This global UWB positioning chip giant was acquired by QORVO in 2020.
And Mi Sound main control chip R329 is a highly integrated SoC launched by Allwinner Technology for the smart voice flagship market, equipped with dual-core A53 1.5G CPU, built-in dual-core 400MHz HiFi4 and 800MHz AIPU 0.25TOPS.
Summary information
The whole machine uses a total of 29 screws to fix, and it is not difficult to disassemble. The internal dust protection measures are well done. The speakers, cables and microphones are all protected by foam, and the power interface is connected to the motherboard separately.
Xiaomi Sound uses a 2.25 inch neodymium iron boron dual magnetic circuit full frequency unit, and the sound cavity supports dual suspension passive radiators on both sides. In terms of heat dissipation, a separate metal heat sink is used, and thermal conductive silicone grease is affixed to the inside and outside of the shielding case on the motherboard for heat dissipation. (Editor: Judy)
Friends who are interested in digital products, remember to pay more attention to eWisetech, and learn about dismantling equipment information as soon as possible. Finally, I remind everyone that there are various digital product evaluation and disassembly in eWisetech, you can check it step by step!
Mobile phone: iPhone 13
Tablet: Honor V7 Pro
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Smart wear: Shaoyin bone conduction headset
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