Today’s hot spots
1. Has DRAM not bottomed out yet? Nanya was once again criticized by the capital market
2. PC and server purchases fell by more than 30% quarterly, Micron was criticized by Morgan Stanley
3. Yangtze Memory launched enterprise-class PCIe 4.0 NVMe solid state drives PE310 series
4. Supported by the automotive and industrial markets, NOR Flash prices from Taiwanese manufacturers have remained stable
5. 30+TB! Seagate next-generation HAMR mechanical hard drive will be shipped in 2023
6. Wafer OEM mature process capacity is loose, and the price reduction trend is coming
7. Going to set up a factory in India? It is rumored that TSMC and United Microelectronics will go to India to inspect
8. Struggling with Taiwan’s non-memory chip market, South Korea will provide both discounts and talents
01
DRAM has not bottomed out yet? Nanya has received bad reviews from the capital market.
According to Taiwanese media "Financial News", the latest report issued by US investment institutions pointed out that the demand for cloud computing semiconductors is deteriorating. Coupled with the expected price erosion, Micron's competitors are In the third quarter, ultra-large-scale DRAM quotations fell by more than 20%, which significantly weakened the DRAM pricing environment. Therefore, Nanya reiterated its rating of "underperforming and the broader market " and believed that its consumer DRAM prices will enter the downside risk in the third quarter.
American investment institutions stated that has a conservative attitude towards the industry prospects due to weak potential DRAM prices. It has set the target price of Nanya at 48 yuan and predicts that this year’s investment return will be about 10%, lower than 14% in 2021. .
As for the upside risk , US investment institutions believe that DRAM prices will be maintained in 2023 due to tighter supply and stronger demand; the pricing environment is expected to strengthen in the second half of this year, with revenue exceeding expectations; 1a/1b nanometer upgrades are progressing quickly than expected.
Downside risks include the slower-than-expected upgrade of the 1a/1b nanometer process, the reduced demand for Specialty DRAM (Specialty DRAM) in 4K, 2K TVs and smart set-top boxes, and the faster increase in Hefei Changxin Storage production.
02
PC and server purchases fell by more than 30% quarterly, and Micron was criticized by Morgan Stanley.
According to Taiwanese media MoneyDJ, the US storage giant Micron was criticized by Morgan Stanley , and its investment rating was downgraded from "neutral weight". To "reduce", dragging down the overall trend of semiconductor stocks on the 22nd.
Micron CEO Sanjay Mehrotra pointed out when announcing the financial report on June 30 that as the third quarter (March-May) approached the end of the quarter, signs of a sharp decline in short-term bit demand were observed, mainly due to the consumer market (including PC , smartphones) are affected by the weak terminal market. He said at the time that the consumer market was impacted by weak consumer spending in China, the war between Russia and Ukraine, and rising global inflation.
In this regard, Barron's and Investing.com reported that Morgan Stanley analyst Joseph Moore issued a report on the 22nd saying that although Micron's outlook is conservative, the market does continue to deteriorate, both in terms of shipments and quotations.
Moore said that he has heard that many Micron customers are adopting more active strategies for inventory management. Some PC and server manufacturers have seen their DRAM purchases drop by as much as 30% this quarter. Micron's rivals' DRAM quotations for cloud computing have also fallen this week. More than 20%.
03
Yangtze Storage launches enterprise-class PCIe 4.0 NVMe SSD PE310 series
On July 25, Yangtze Storage launched the first enterprise-class PCIe 4.0 NVMe SSD PE310 series, officially entering the high-end enterprise-class SSD market. This product marks another important layout of Yangtze Memory in the field of storage system solutions after consumer-grade solid-state drives and embedded memories.
What’s interesting is that 2 months ago, in sync with the news that Yangtze Memory’s “192-layer NAND samples have been handed over to a few major manufacturers for verification and will be officially unveiled within the year”, it was also reported that it also has “PE310 and PE320 models” "The master controller has been verified by PCI-SIG", which was later clarified by Yangtze River Storage. The two were not master controller models, but SSD product models. Now, PE310 seems to be an enterprise-class solid state drive.
It is reported that the Yangtze Memory PE310 series is built on the third-generation three-dimensional flash memory chip based on Xtacking®2.0 (Xtacking®2.0) technology. It adopts U.2 interface, PCIe 4.0, NVMe1.4 protocol, and has read-intensive (1.92 TB/3.84TB/7.68TB) and hybrid application (1.6TB/3.2TB/6.4TB) product designs, featuring high performance, high durability, low power consumption, and multi-level power consumption and performance management. Suitable for big data, cloud computing, streaming media and other scenarios. The
PE310 series is said to have the following features:
- Strong and stable performance
- 's excellent power consumption performance
- Safe and reliable data protection
- Easy-to-use standard log interface
- Xtacking® 2.0 (Xtacking® 2.0)
The PE310 series solid-state drives have 4K random read and write steady-state performance of up to 1000K IOPS and 380K IOPS. Its internal intelligent scheduling mechanism can process different I/Os in a timely manner, effectively Solve I/O congestion and ensure I/O service quality and performance consistency.
benefits from the three-dimensional flash memory chip using Jingstack® 2.0 technology. The maximum operating power consumption of the PE310 series solid-state drives is 14W (1.92TB product is 12W), and the energy efficiency ratio is leading the industry's contemporaneous products. The built-in 8-level performance-power management mechanism provides elastic computing flexibility, accurate and convenient for customers to manage energy consumption in different scenarios.
PE310 series solid state drives support LDPC error correction, full-path data protection, enhanced power-off protection (PLP), AES self-encryption, enhanced secure erasure (Sanitize) and other functions to ensure that data is in a safe and reliable storage environment .
The PE310 series solid state drives support the Telemetry standard interface. Users can easily obtain device logs through standard nvmecli commands, which reduces operation and maintenance costs and improves access efficiency.
PE310 series solid state drives adopt third-generation three-dimensional flash memory chips based on Xtacking® 2.0 technology. The stable and excellent particle quality can support the smooth operation of data centers and enterprise servers 24/7.
Currently, Yangtze Memory PE310 series solid state drives are available on the market.
04
Automotive and industrial markets support, Taiwanese NOR Flash prices remain stable
According to Taiwanese media "Business Times", although the sales momentum of consumer electronics is weak and affects the chip production chain shipments, the demand for automotive and industrial chips remains strong. Storage manufacturers Winbond and Macronix have adjusted their product line layouts last year, and this year they have made full efforts to attack the automotive and industrial NOR Flash markets. They have not only avoided the impact of sluggish demand in the consumer market, but the average selling price (ASP) has remained stable and stable. See price pressure.
The Russian-Ukrainian war and global inflation have led to a weakening of consumer electronics sales. The consumer chip production chain has entered the inventory correction stage ahead of schedule. However, markets including automotive and industrial markets are still facing the pressure of insufficient supply of chips. In the NOR Flash market, Winbond and Macronix have downplayed shipments of consumer applications in the second half of last year and turned to automotive and industrial fields to expand market share. Therefore, GigaDevice , which has recently focused on the consumer market, intends to use Price cuts stimulated shipments, but had little impact on Winbond and Macronix.
As electric vehicles become the mainstream in the future, the penetration rate of advanced driver assistance systems (ADAS) increases, and car manufacturers’ demand for NOR Flash with high capacity, high reliability, low power consumption, and safety continues to grow. Furthermore, the demand for 5G infrastructure and data center construction remains high, and new applications such as multi-orbit satellites and edge Internet of Things are taking off rapidly.
05
30+TB! Seagate's next-generation HAMR mechanical hard drive will ship in 2023
According to WccfTech reports, Seagate has now revealed that it will launch its next-generation hard drive in mid-2023, using the latest heat-assisted magnetic recording (HAMR) technology and providing a capacity of more than 30TB.
According to reports, Seagate HAMR platform will launch a 30+TB model in mid-2023, and will continue to increase to 40+TB and 50+TB later, but the specific launch time of subsequent models has not been announced.
Seagate CEO David Mosley said on Seagate's recent earnings call that Seagate is moving forward on the development path of the 30+TB HDD series with HAMR technology and is expected to start shipping these HAMR-based products to customers this time next year.
reports that the 2023 30TB HAMR HDD will not be shipped in large quantities and is expected to be shipped only to selected customers in the data center market. Seagate’s HAMR technology will change HDD memory, magnetic layers, read-write heads, controllers, actuators and other parts. Some people speculate that making new parts will be more difficult to produce and more expensive for customers.
06
The production capacity of mature wafer foundry processes is loosening, and a wave of price cuts is coming.
According to Taiwan media "Economic Daily", the production capacity of mature wafer foundry processes is loosening, and a wave of price cuts is coming. Taiwan's IC design industry has confirmed that mainland China's wafer foundries have fired the first shot and have recently cut prices by more than 10%. In order to prevent the loss of orders, Taiwan's wafer foundries have begun to offer "preferential prices" and discounts on some specific processes. About a single-digit percentage, which is equivalent to a disguised price reduction.
Mainland wafer foundry mature process indicators include SMIC, Huahong, Jinghe, Hejian, etc.; Taiwan is dominated by UMC, Worldwide, and Power Semiconductor. As prices begin to fall, it affects the subsequent operations of related businesses.
An unnamed IC design industry revealed that the wafer prices of many of its chips produced in wafer foundries in mainland China have been reduced by more than 10%. It is expected that the cost of related chips will be reduced starting from the fourth quarter.
Another IC design industry did not shy away from saying that news spread quickly in the industry. After mainland wafer foundries lowered their prices, Taiwanese factories also responded by offering single-digit percentage "discounts" for some processes, thereby reducing the flow of orders to mainland factories. Risk, this is tantamount to "disguised price reduction", but these are "private agreements" between buyers and sellers, "will not tell others with gongs and drums", because if other customers hear the relevant information, they may misunderstand that it is a comprehensive price reduction. , which led to a lot of haggling, so no one wanted to admit it.
07
is going to set up a factory in India? It is rumored that TSMC and UMC will go to India to inspect
According to a report by the local Hindustan Times in India, people familiar with the matter pointed out that after India visited Taiwan twice in 2021 to discuss semiconductor cooperation, including Taiwanese industry representatives such as TSMC and UMC The delegation will visit India in the coming weeks for an undetermined period and will discuss setting up local factories and cooperating with local manufacturers in manufacturing chips needed for electronic products, communication equipment, healthcare systems and motor vehicles.
Relevant people familiar with the matter said that this visit will allow Taiwanese semiconductor manufacturers such as TSMC and UMC to learn more about the semiconductor plan announced by the Indian government in December 2021, which includes a US$10 billion stimulus award that has been approved. A subsidy program to attract investment from semiconductor manufacturers and display manufacturers, with a view to making India a part of the global electronics production hub.
08
is locked in Taiwan's non-memory chip market. South Korea will provide both discounts and talents
The South Korean government announced on the 21st that it will increase tax incentives for R&D and related facilities investment in the semiconductor industry to enable industrial companies to invest at least 340 trillion by 2026. South Korea also plans to open a semiconductor engineer training center this year to provide more than 150,000 talents within 10 years and help Korean companies increase their global non-storage semiconductor market share from 3% to 10%. can reduce dependence on imported materials, components and equipment from 70% to about 50% by 2030.
According to the Korean media "BusinessKorea", the government stated that the semiconductor industry factory floor area ratio will be increased from 350% to 490% in order to increase the number of clean room facilities in Pyeongtaek and Yongin Technology Park factories from 12 and 9. 18 and 12. Semiconductor factories will add a total of more than 9,000 jobs.
It is applicable to the facility investment tax exemption of large semiconductor companies, and the proportion will increase from 6% to 10% to 8% to 12%. Starting in September, semiconductor companies affected by Japan's export restrictions will also be allowed to relax the weekly working hour limit from 52 hours to 64 hours.
In terms of talent training, the Korean government expects to increase the number of semiconductor research institutes starting in 2023, and the government will provide equipment and financial subsidies. The 30 universities that started offering double major courses for non-semiconductor majors this year will also continue. Overall, the government and private entities will invest a total of 350 billion won from 2023 to 2032 to support university research institutes in cultivating semiconductor professionals.
In terms of research and development of non-storage semiconductor chips , preliminary feasibility studies of 450 billion won and 500 billion won will be launched in the power and automotive semiconductor fields from 2024 to 2030 respectively. It will also invest 1.25 trillion won in the research and development of AI chips in the next seven years, and spend 1.5 trillion won to invest in 30 promising fabless IC design companies.
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