1th is coming, and the blessing of Double Eleven is destined to be an extraordinary month. Among them, Qualcomm previewed that the Snapdragon summit will be held in November this year, and the Snapdragon 8 Gen 2 flagship chip is expected to be released, while the other side of MediaTek 's Dimensity 9 iteration chip is also coming.
As a well-known blogger had previously revealed that the Dimensity 9 series iteration platform is called "DX2" in the industry, and the official name cannot be confirmed. Judging from the supply chain situation he has learned so far, the new phones that are already under development include two models of vivo X series, one of OPPO Find X series, and another of a certain e-sports game brand. Considering that Xiaomi has launched the Redmi K40 game enhanced version equipped with MediaTek flagship platform, it is not ruled out that it is a Redmi gaming phone.
DX2’s shipment time is much earlier than Dimensity 9000. The first terminal product equipped with DX2 will be released at the end of the year. In terms of performance, at present, the engineering machine equipped with Dimensity DX2 chip has a slightly better score than Qualcomm Snapdragon 8 Gen 2. Considering that many models equipped with Snapdragon 8 Gen 2 will also be released at the end of the year, this time Qualcomm and MediaTek can be described as "the flagship core showdown at the shipping threshold."
Qualcomm MediaTek flagship line mid-range line is coming in rotation, Snapdragon 8 Gen 2 terminal progress is faster than Dimensity 9 Series iterative terminal, and Snapdragon 7 True iterative terminal is later than Dimensity 8 Series. They all use TSMC technology without exception. Samsung has a bad reputation in the past two generations. 4nm has been quickly transferred to Snapdragon 6 Series and wearable chips, although there will be victims of Snapdragon 7 Gen1 next.
The blogger also said, “ mobile phone chip has reached the 3.4-3.5GHz gap. Next year, Snapdragon 8 Gen 2 may have an ultra-high frequency version of “factory ashes”. The scale of GPU will be further improved on this year’s basis. Dimensity 9 Series continues to fill up CPUs. The limit performance of Android flagship core GPU can already be used as Apple ’s official A-generation series. Of course, the gap between CPU and medium and low frequency energy consumption is still very obvious.”
Recently, the latest news showed that this Dimensity 9 Series chip called “DX2” is officially named Dimensity 9200, and is expected to be released in November. According to convention, the Dimensity 9200 chip is expected to use X3 large-core CPU and the latest G715 GPU of ARM, which will make a significant improvement. In terms of performance, currently, the Dimensity DX2 chip engineering machine has a small victory over Qualcomm Snapdragon 8 Gen 2.
From the supply chain channel, the new Dimensity 9200 phone includes two vivo X series and one OPPO Find X series. However, vivo X90 Pro will not be equipped with this chip, but will focus on Snapdragon 8 Gen 2. Currently, new Xiaomi 13 series and Samsung S23 series equipped with Snapdragon 8 Gen 2 have been added to the network, which also means that after the release of Qualcomm Snapdragon 8 Gen 2, it will usher in a new phone equipped with this chip, and the new phone launch wave will be officially launched in the second half of the year.
If Dimensity 9200 is officially released next month as scheduled, then the models equipped with Dimensity 9200 chip and the models equipped with Snapdragon 8 Gen 2 will usher in a head-on confrontation. According to the usual practices of domestic mobile phone manufacturers, the two chips will be more radical in scheduling, and whether Qualcomm, which switched to TSMC, can control heating and power consumption this time, has also become the focus of many users' attention.
